Patents by Inventor Hiroaki Jiroku

Hiroaki Jiroku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060145281
    Abstract: A semiconductor device includes a substrate that is provided with a first main surface and a second main surface, a light shielding film that is disposed in a groove formed in the first main surface, and a semiconductor element that has a semiconductor film. The light shielding film is disposed between the second main surface and the semiconductor film.
    Type: Application
    Filed: December 8, 2005
    Publication date: July 6, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Hiroaki Jiroku
  • Publication number: 20060027811
    Abstract: An active matrix substrate includes a load circuit including a first active element performing a switching operation of a load, the first active element including a semiconductor film of a substantially polycrystalline state; a drive circuit including a second active element controlling driving the load, the second active element including a semiconductor film of a substantially single crystalline state, a hole being provided to one of a part and a peripheral part of the semiconductor film, the hole functioning a starting point for crystallizing the semiconductor film; and a substrate on a same plane of which the load circuit and the drive circuit are formed.
    Type: Application
    Filed: June 22, 2005
    Publication date: February 9, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Hiroaki Jiroku
  • Patent number: 6884699
    Abstract: A process for making a polycrystalline silicon film includes forming, on a glass substrate, an amorphous silicon film having a first region and a second region that contacts the first region, forming a first polycrystalline portion by irradiating the first region of the amorphous silicon film with laser light having a wavelength not less than 390 nm and not more than 640 nm and forming a second polycrystalline portion that contacts the first polycrystalline portion by irradiating the second region and the portion of the region of the first polycrystalline portion that contacts the second region of the amorphous silicon film with the laser light.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: April 26, 2005
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Seiko Epson Corporation
    Inventors: Tetsuya Ogawa, Hidetada Tokioka, Junichi Nishimae, Tatsuki Okamoto, Yukio Sato, Mitsuo Inoue, Mitsutoshi Miyasaka, Hiroaki Jiroku
  • Patent number: 6602765
    Abstract: An object is to fabricate high quality thin-film semiconductor devices at comparatively low temperatures. After providing a local heating system, an active semiconductor layer is formed, and melt crystallization is promoted by irradiating a pulsed laser onto the active semiconductor layer.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: August 5, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Hiroaki Jiroku, Mitsutoshi Miyasaka, Hidetada Tokioka, Tetsuya Ogawa
  • Publication number: 20020052069
    Abstract: An object is to fabricate high quality thin-film semiconductor devices at comparatively low temperatures. After providing a local heating system, an active semiconductor layer is formed, and melt crystallization is promoted by irradiating a pulsed laser onto the active semiconductor layer.
    Type: Application
    Filed: June 8, 2001
    Publication date: May 2, 2002
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hiroaki Jiroku, Mitsutoshi Miyasaka, Hidetada Tokioka, Tetsuya Ogawa