Patents by Inventor Hiroaki Kaito
Hiroaki Kaito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7334318Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.Type: GrantFiled: January 18, 2005Date of Patent: February 26, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Patent number: 7188404Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: GrantFiled: January 18, 2005Date of Patent: March 13, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Patent number: 7165315Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: GrantFiled: January 18, 2005Date of Patent: January 23, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Patent number: 6935016Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: GrantFiled: January 17, 2001Date of Patent: August 30, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Publication number: 20050158960Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: ApplicationFiled: January 18, 2005Publication date: July 21, 2005Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Publication number: 20050153515Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: ApplicationFiled: January 18, 2005Publication date: July 14, 2005Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Publication number: 20050125991Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: ApplicationFiled: January 18, 2005Publication date: June 16, 2005Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Publication number: 20030132828Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate (11) made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer (12) formed on a top face of discrete substrate (11); resistor layer (13) formed such that a part of resistor layer (13) overlaps top electrode layer (12); protective layers (14, 16) formed so as to cover resistor layer (13); side electrode layer (17) formed on a side face of discrete substrate (11) such that side electrode layer is electrically coupled to top electrode layer (12).Type: ApplicationFiled: October 22, 2002Publication date: July 17, 2003Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
-
Publication number: 20020015752Abstract: The present invention provides a precision device molding machine and a molding method to make it possible for an adjustment of parallelism to be performed with a high degree of accuracy and excellent workability. The precision device molding machine includes a parallelism adjustment mechanism held by a supporting plate, a pressure applying plate that is movable up and down, a lower die disposed on the upper surface of the pressure applying plate and an upper die disposed on the parallelism adjustment mechanism. The parallelism adjustment mechanism includes a pressure receiving member, an adjusting plate, a transmitting member disposed between the pressure receiving member and the adjusting plate, a fixed fulcrum and an operating member.Type: ApplicationFiled: April 25, 2001Publication date: February 7, 2002Inventors: Kiyotaka Kamohara, Takeyuki Fujii, Hiroaki Kaito