Abstract: The present disclosure provides systems for growing and, modeling lung cells in organoid cultures and methods of using same.

Abstract: An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.

Abstract: An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.

Abstract: The magnitude of an amplitude waveform of an electromagnetic wave generated when irradiating a pulse laser beam to a structure A including diffusion regions provided in the structure of a semiconductor device to be inspected is compared with the magnitude of an amplitude waveform of an electromagnetic wave radiated when irradiating the pulse laser beam to a structure A of a reference device measured in advance, and the detection sensitivity of the electromagnetic wave is corrected (S14). Thereafter, measurement errors caused by variations in the detection sensitivity of electromagnetic waves of an inspecting apparatus are eliminated by inspecting the semiconductor device as an inspection target, so that the quality of the semiconductor device is precisely determined (S16).

Abstract: The magnitude of an amplitude waveform of an electromagnetic wave generated when irradiating a pulse laser beam to a structure A including diffusion regions provided in the structure of a semiconductor device to be inspected is compared with the magnitude of an amplitude waveform of an electromagnetic wave radiated when irradiating the pulse laser beam to a structure A of a reference device measured in advance, and the detection sensitivity of the electromagnetic wave is corrected (S14). Thereafter, measurement errors caused by variations in the detection sensitivity of electromagnetic waves of an inspecting apparatus are eliminated by inspecting the semiconductor device as an inspection target, so that the quality of the semiconductor device is precisely determined (S16).

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is separate from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is a separate body from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: A bottom surface of a medium tank 1 is closed with a polymer film 2, the polymer film 2 is stuck to the medium tank 1 by reducing the pressure of the inside of the medium tank 1, an ultrasonic wave transmission medium 5 is injected while reducing the pressure of the inside of the medium tank 1 so that the distal end of an ultrasonic probe 3 is immersed, the inside of the medium tank 1 is pressurized while keeping an inspection object 6 in contact with the polymer film 2, an ultrasonic wave reflected by the inspection object is received by the ultrasonic probe 3.