Patents by Inventor Hiroaki Kiyomiya

Hiroaki Kiyomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for bonding substrate plates together through gap-forming sealer material
    Patent number: 6790300
    Abstract: Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: September 14, 2004
    Assignee: Hitachi Electronics Engineering Co., Ltd.
    Inventors: Hiroyuki Watanabe, Yuji Otsubo, Shinji Sugizaki, Hisayoshi Ichikawa, Hiroaki Kiyomiya
  • Method and apparatus for bonding substrate plates together through gap-forming sealer material
    Publication number: 20020043344
    Abstract: Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.
    Type: Application
    Filed: September 14, 2001
    Publication date: April 18, 2002
    Applicant: Hitachi Electronics Engineering Co., Ltd.
    Inventors: Hiroyuki Watanabe, Yuji Otsubo, Shinji Sugizaki, Hisayoshi Ichikawa, Hiroaki Kiyomiya