Abstract: A non-contact power transmission system according to the present disclosure includes a power transmitting coil and a power receiving coil facing the power transmitting coil. At least one of the power transmitting coil and the power receiving coil includes a first coil in which a wire is wound around a first core, and a second coil in which a wire is wound around a second core. The second coil is placed at at least one end of a winding axis of the first coil. A winding axis of the second coil is inclined with respect to the winding axis of the first coil toward the power transmitting or receiving coil that faces the second coil.

Abstract: A coil for a non-contact power transmission system according to the present disclosure is used in a non-contact power transmission system to transmit electric power via a non-contact method. The coil includes a magnetic body with a flat cross section, and a wire wound around the magnetic body. The wire is wound around a shorter side surface of the magnetic body at a predetermined angle with respect to a direction perpendicular to a longer side surface of the magnetic body.

Abstract: A contactless power transmission device includes a power receiver, a power feeder configured to contactlessly feed power to the power receiver, the power feeder including a primary coil configured to generate magnetic flux by an input alternating current voltage, and a cover configured to cover the primary coil, and a capacitive sensor configured to supply an alternating current voltage to an electrode to measure a capacitance occurring between the electrode and foreign matter present around the cover and thereby detect the foreign matter. The frequency of the alternating current voltage of the capacitive sensor is set to be higher than the frequency of the magnetic flux generated by the primary coil.

Abstract: A power feeder of a contactless power transmission device includes a housing base member, a primary coil provided on the housing base member and configured to generate magnetic flux, a cover attached to the housing base member and configured to cover the primary coil, a capacitance sensor including a detection electrode between the primary coil and the cover, and configured to detect foreign matter around the cover based on a change in capacitance detected using the detection electrode, and a high-dielectric member embedded in the cover and having a permittivity higher than that of a material for the cover.

Abstract: An indoor dust collecting system includes an air conditioner having an indoor unit that generates an air current, a dust collector, and a controller for controlling the air current from the indoor unit. A moving body detector is provided to detect a moving body such as, for example, a person, a pet, a cleaning robot, and the like. The air current from the indoor unit is controlled by the controller based on the position of the indoor unit, the position of a spot of occurrence of dust detected by the moving body detector, and the position of the dust collector such that the air current from the indoor unit reaches the dust collector via the spot of occurrence of dust in order for the dust collector to effectively suck the dust.

Abstract: An indoor dust collecting system includes an air conditioner having an indoor unit that generates an air current, a dust collector, and a controller for controlling the air current from the indoor unit. A moving body detector is provided to detect a moving body such as, for example, a person, a pet, a cleaning robot, and the like. The air current from the indoor unit is controlled by the controller based on the position of the indoor unit, the position of a spot of occurrence of dust detected by the moving body detector, and the position of the dust collector such that the air current from the indoor unit reaches the dust collector via the spot of occurrence of dust in order for the dust collector to effectively suck the dust.

Abstract: A printed wiring board group includes a plurality of printed wiring boards wherein a difference (???AB) between an average electric resistance (A-ave.) of wires formed in one printed wiring board (A) and an average electric resistance (B-ave.) of wires formed in a printed wiring board (B) adjacent to the printed wiring board (A) is within a range of ±5% of an average electric resistance (AB-ave.) of the wires of the printed wiring boards (A) and (B); and a difference (???ab) between an electric resistance (a-3) of an outermost wire of the printed wiring board (A) and an electric resistance (b-3) of an outermost wire of the printed wiring board (B) is within a range of ±11.05%, preferably within a range of ±6.12%, and is particularly preferably within a range of ±6.00% of the average electric resistance (AB-ave.) of the printed wiring boards (A) and (B).

Abstract: Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.

Abstract: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 ?g/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.

Abstract: The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also provides a method for producing the flexible wiring substrate.

Abstract: Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.

Abstract: A film carrier tape for mounting electronic components has a wiring with a wire pitch of 35 ?m or less. A method for manufacturing such film carrier tape is also disclosed. The film carrier tape for mounting electronic components is manufactured using a specific flexible conductor foil clad laminate as a wiring forming material. The flexible conductor foil clad laminate includes a base film and a conductor foil having a surface roughness (Rzjis) of a bonded surface of 2.5 ?m or less and a surface roughness (Rzjis) of a resist-side surface of 1.0 ?m or less. The flexible conductor foil clad laminate may be a flexible copper clad laminate in which a glossy-surface-processed electrolytic copper foil has a surface roughness (Rzjis) of a bonded surface of 2.5 ?m or less and a surface roughness (Rzjis) of a resist-side surface of 1.5 ?m or less and in which the copper foil is half etched as required to not less than half an original thickness.

Abstract: A printed wiring board group includes a plurality of printed wiring boards wherein a difference (???AB) between an average electric resistance (A-ave.) of wires formed in one printed wiring board (A) and an average electric resistance (B-ave.) of wires formed in a printed wiring board (B) adjacent to the printed wiring board (A) is within a range of ±5% of an average electric resistance (AB-ave.) of the wires of the printed wiring boards (A) and (B); and a difference (???ab) between an electric resistance (a-3) of an outermost wire of the printed wiring board (A) and an electric resistance (b-3) of an outermost wire of the printed wiring board (B) is within a range of ±11.05%, preferably within a range of ±6.12%, and is particularly preferably within a range of ±6.00% of the average electric resistance (AB-ave.) of the printed wiring boards (A) and (B).

Abstract: A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) and (D) below. (A) The wiring pattern includes copper particles having a mean crystal particle diameter in the range of from 0.65 to 0.85 ?m as determined by EBSP; not more than 1% of the volume of the wiring pattern is accounted for by copper crystal particles having a particle diameter of less than 1.0 ?m as determined by EBSP; and copper crystal particles that are [100] oriented in the longitudinal direction of a lead of the wiring pattern account for from 10 to 20% of the volume of the wiring pattern as determined by EBSP.

Abstract: An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 ?m and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 ?m.

Abstract: An object of the present invention is to provide a flexible printed wiring board, excellent in folding ability, obtained from a flexible copper-clad laminate using an electro-deposited copper foil. In order to achieve the object, there is provided a two-layer flexible printed wiring board having a wiring, formed by etching an electro-deposited copper foil, on a surface of a resin film layer, the wiring including only a steady-deposition crystal layer 2 formed by removing an initial-deposition crystal layer 1 formed at the time of the electro-deposited copper foil preparation. When the two-layer flexible printed wiring board has a cover film layer, preferably the deviation between the neutral line of the sectional thickness of the two-layer flexible printed wiring board and the central line of the wiring thickness of the two-layer flexible printed wiring board falls within 5% of the total thickness of the two-layer flexible printed wiring board.

Abstract: The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also provides a method for producing the flexible wiring substrate.

Abstract: A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.