Patents by Inventor Hiroaki Kurishima
Hiroaki Kurishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7510611Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.Type: GrantFiled: March 29, 2005Date of Patent: March 31, 2009Assignee: Tokyo Electron LimitedInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Patent number: 7488505Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.Type: GrantFiled: July 8, 2004Date of Patent: February 10, 2009Assignee: Tokyo Electron LimitedInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Publication number: 20050170087Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.Type: ApplicationFiled: March 29, 2005Publication date: August 4, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Patent number: 6884294Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.Type: GrantFiled: April 16, 2002Date of Patent: April 26, 2005Assignee: Tokyo Electron LimitedInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Publication number: 20040261701Abstract: A coating solution is supplied to a substrate as an experimental substrate that is the same type as a product substrate while the experimental substrate is being scanned by a nozzle so as to form a line of the coating solution. The line of the coating solution is photographed by for example a CCD camera so as to obtain a contact angle of the coating solution. Using a geometric model according to the contact angle, relation data of a discharge flow amount of the coating solution nozzle at a scanning speed for a real coating process for the product substrate and an allowable range of a pitch is obtained. Relation data of the discharge flow amount of the coating solution nozzle and the pitch is pre-created for each of a plurality of targets of the film thickness. According to the relation data, the pitch is decided.Type: ApplicationFiled: August 19, 2004Publication date: December 30, 2004Inventors: Shinji Kobayashi, Takahiro Kitano, Masateru Morikawa, Norihisa Koga, Tomohide Minami, Shinichi Sugimoto, Jun Ookura, Hiroaki Kurishima
-
Publication number: 20040241320Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.Type: ApplicationFiled: July 8, 2004Publication date: December 2, 2004Applicant: TOKYO ELECTRON LIMITEDInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Patent number: 6776845Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.Type: GrantFiled: May 23, 2002Date of Patent: August 17, 2004Assignee: Tokyo Electron LimitedInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Publication number: 20020176928Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.Type: ApplicationFiled: May 23, 2002Publication date: November 28, 2002Applicant: TOKYO ELECTRON LIMITEDInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima
-
Publication number: 20020150679Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.Type: ApplicationFiled: April 16, 2002Publication date: October 17, 2002Applicant: TOKYO ELECTRON LIMITEDInventors: Tomohide Minami, Shinichi Sugimoto, Takahiro Kitano, Jun Ookura, Hiroaki Kurishima