Patents by Inventor Hiroaki MACHITANI

Hiroaki MACHITANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107679
    Abstract: An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Hiroaki MACHITANI
  • Patent number: 11910526
    Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 20, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Daigo Tsubai, Hiroaki Machitani
  • Patent number: 11825598
    Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 21, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryosuke Sasaoka, Yasunari Oyabu, Hiroaki Machitani, Hayato Takakura
  • Publication number: 20230240007
    Abstract: A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.
    Type: Application
    Filed: May 27, 2021
    Publication date: July 27, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daigo TSUBAI, Naoki SHIBATA, Hiroaki MACHITANI
  • Publication number: 20230098947
    Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.
    Type: Application
    Filed: February 24, 2021
    Publication date: March 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hiroaki MACHITANI, Teppei NIINO
  • Publication number: 20220287177
    Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Daigo TSUBAI, Hiroaki MACHITANI
  • Publication number: 20220192010
    Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 16, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryosuke SASAOKA, Yasunari OYABU, Hiroaki MACHITANI, Hayato TAKAKURA
  • Patent number: 11272615
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 8, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Hiroaki Machitani, Yasunari Oyabu, Masaki Ito, Kenya Takimoto
  • Publication number: 20210212208
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoki SHIBATA, Hiroaki MACHITANI, Yasunari OYABU, Masaki ITO, Kenya TAKIMOTO