Patents by Inventor Hiroaki MACHIYA

Hiroaki MACHIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION FOR SKIN PACK, FILM FOR SKIN PACK, METHOD FOR PRODUCING FILM FOR SKIN PACK, SKIN PACK PACKAGING MATERIAL, AND SKIN PACK PACKAGE
    Publication number: 20240150606
    Abstract: Provided is a resin composition for a skin pack, which contains an ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer. The ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer satisfies the relationship 11?(X×Y×0.01)/Z. This resin composition for a skin pack contains the ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer. The melt tension of the ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer, as measured using a specific measurement method is 320 mN or more.
    Type: Application
    Filed: March 11, 2022
    Publication date: May 9, 2024
    Inventors: Kenta MUKAI, Yoshiteru TANIGUCHI, Hiroaki MACHIYA
  • Resin composition for sealant, laminate, packaging material, and package
    Patent number: 11898065
    Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: February 13, 2024
    Assignee: DOW-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Hiroaki Machiya, Hisao Gonohe, Yoshitaka Hironaka
  • RESIN COMPOSITION FOR SEALANT, LAMINATE, PACKAGING MATERIAL, AND PACKAGE
    Publication number: 20210403770
    Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.
    Type: Application
    Filed: November 19, 2019
    Publication date: December 30, 2021
    Inventors: Koichi NISHIJIMA, Hiroaki MACHIYA, Hisao GONOHE, Yoshitaka HIRONAKA
  • COMPOSITION FOR SKIN PACK, SEALANT FOR SKIN PACK, AND PACKAGE FOR SKIN PACK
    Publication number: 20210024732
    Abstract: A composition for a skin pack is provided, which includes: an ionomer (A) of an ethylene/unsaturated carboxylic acid copolymer having a melt flow rate (JIS K 7210-1999, 190° C. 2160 g load) of 6 g/10 min or more; and a polyolefin (B) having a melt flow rate (JIS K 7210-1999, 190° C., 2160 g load) of 6 g/10 min or less, in which a content of the polyolefin (B) is from 20% by mass to 50% by mass with respect to 100% by mass of resin components in the composition for a skin pack.
    Type: Application
    Filed: March 19, 2019
    Publication date: January 28, 2021
    Inventors: Koichi NISHIJIMA, Yoshitaka HIRONAKA, Hiroaki MACHIYA, Hisao GONOHE