Abstract: An emergency report can be made to a plurality of emergency services. Provided is a communication control device 2 housing a subscriber terminal 1, and the communication control device 2 includes: a call control unit 21 that connects an emergency call made from the subscriber terminal 1 to an emergency-call reception switchboard 5; and an outgoing/incoming call inhibition unit 22 that inhibits outgoing/incoming calls from/to the subscriber terminal 1 in a prescribed period, when the emergency call is disconnected by the subscriber terminal 1. The outgoing/incoming call inhibition unit 22: when a call is made from the subscriber terminal 1 in the prescribed period, determines whether the call is an emergency call or a general call; in a case of an emergency call, cancels inhibition for outgoing/incoming calls from/to the subscriber terminal 1 and connects the call by using the call control unit 21; and in a case of a general call, does not connect the call.

Abstract: An emergency report can be made to a plurality of emergency services. Provided is a communication control device 2 housing a subscriber terminal 1, and the communication control device 2 includes: a call control unit 21 that connects an emergency call made from the subscriber terminal 1 to an emergency-call reception switchboard 5; and an outgoing/incoming call inhibition unit 22 that inhibits outgoing/incoming calls from/to the subscriber terminal 1 in a prescribed period, when the emergency call is disconnected by the subscriber terminal 1. The outgoing/incoming call inhibition unit 22: when a call is made from the subscriber terminal 1 in the prescribed period, determines whether the call is an emergency call or a general call; in a case of an emergency call, cancels inhibition for outgoing/incoming calls from/to the subscriber terminal 1 and connects the call by using the call control unit 21; and in a case of a general call, does not connect the call.

Abstract: A light-emitting device includes a substrate including a substrate second upper surface provided between a substrate bottom surface and a substrate first upper surface in a height direction. A light-emitting element to emit ultraviolet light is provided on the substrate first upper surface. A protective element includes a protective element upper surface provided between the substrate first upper surface and the substrate second upper surface in the height direction. A frame is bonded to the substrate first upper surface via adhesive members to surround the light-emitting element. The frame includes a frame lower surface opposite to the substrate first upper surface and the substrate second upper surface in the height direction to provide a gap between the substrate first upper surface and the frame lower surface. A space in which the light-emitting element is provided communicates with an outside of the light-emitting device via the gap.

Abstract: To provide a semiconductor light emitting element of which color irregularity is improved, the semiconductor light emitting element according to the present invention comprises: a support substrate; a semiconductor laminated structural body provided on the support substrate, the semiconductor laminated structural body having a first semiconductor layer, a luminescent layer, and a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; a light shielding member covering a portion of an upper surface and side surfaces of the semiconductor laminated structural body, the light shielding member electrically separated from both of the first electrode and the second electrode; and a wavelength conversion member covering an upper surface not covered by the light shielding member of the semiconductor laminated structural body.

Abstract: A inner member for an easy handling operation of a wrapping film to be used for wrapping food is formed by a body part 11 and a pinch part 13. The body part 11 includes an upper piece 11a, a front piece 11b and a lower piece 11c for surrounding a wound wrapping film 20, thereby forming a substantially U-shape cross section. The body part 11 further includes at a rear surface thereof a rear opening 11d through which the wound wrapping film 20 passes. The upper piece 11a is provided at a rear end thereof with a guide portion 12 having a substantially circular cross section. The pinch part 13 is swingably projected from a front upper end of the body part 11 and is positioned between a front wall 31 of a film storage box 31 and a vertical lid part 32a of a lid 32.

Abstract: There is provided a focus control apparatus including: an information acquisition unit that acquires focal distance information of a predetermined position on a 2-dimensional map using the 2-dimensional map of focal distances; and a focus control unit that performs focus control based on the focal distance information which is acquired by the information acquisition unit.

Abstract: A light-emitting device includes a substrate including a substrate second upper surface provided between a substrate bottom surface and a substrate first upper surface in a height direction. A light-emitting element to emit ultraviolet light is provided on the substrate first upper surface. A protective element includes a protective element upper surface provided between the substrate first upper surface and the substrate second upper surface in the height direction. A frame is bonded to the substrate first upper surface via adhesive members to surround the light-emitting element. The frame includes a frame lower surface opposite to the substrate first upper surface and the substrate second upper surface in the height direction to provide a gap between the substrate first upper surface and the frame lower surface. A space in which the light-emitting element is provided communicates with an outside of the light-emitting device via the gap.

Abstract: A inner member for an easy handling operation of a wrapping film to be used for wrapping food is formed by a body part 11 and a pinch part 13. The body part 11 includes an upper piece 11a, a front piece 11b and a lower piece 11c for surrounding a wound wrapping film 20, thereby forming a substantially U-shape cross section. The body part 11 further includes at a rear surface thereof a rear opening 11d through which the wound wrapping film 20 passes. The upper piece 11a is provided at a rear end thereof with a guide portion 12 having a substantially circular cross section. The pinch part 13 is swingably projected from a front upper end of the body part 11 and is positioned between a front wall 31 of a film storage box 31 and a vertical lid part 32a of a lid 32.

Abstract: To provide a semiconductor light emitting element with high luminous efficiency, the light emitting element includes: a substrate; a semiconductor laminate placed above the substrate, the semiconductor laminate comprising a second semiconductor layer, an active layer and a first semiconductor layer laminated in this order from the substrate; and a first electrode and a second electrode placed between the substrate and the semiconductor laminate, wherein the semiconductor laminate is divided in a plurality of semiconductor blocks by a groove, wherein the first electrode includes protrusions that are provided in each of the plurality of semiconductor blocks and that penetrate the second semiconductor layer and the active layer to be connected to the first semiconductor layer, and wherein the second electrode is connected to the second semiconductor layer in each of the plurality of semiconductor blocks and has an external connector that is exposed on the bottom of the groove.

Abstract: The light emitting element including: a semiconductor laminate including a first layer, an active layer and a second layer; a first electrode including protrusions that penetrate the second layer and the active layer, the first electrode connected to the first layer via the protrusions; a second electrode connected to the second layer on an lower face of the second layer; and an insulation film between the protrusions and the semiconductor laminate, wherein the protrusions each include a protrusion body covered with the insulation film and a protrusion tip, an upper face and a side face of the protrusion tip being exposed from the insulation film, the first layer includes recesses arranged on an upper face of the first layer so as to sandwich first areas located above the respective the protrusions, and a distance between the recesses sandwiching the first area is larger than a width of the protrusion tip.

Abstract: To provide a semiconductor light emitting element with high luminous efficiency, the light emitting element includes: a substrate; a semiconductor laminate placed above the substrate, the semiconductor laminate comprising a second semiconductor layer, an active layer and a first semiconductor layer laminated in this order from the substrate; and a first electrode and a second electrode placed between the substrate and the semiconductor laminate, wherein the semiconductor laminate is divided in a plurality of semiconductor blocks by a groove, wherein the first electrode includes protrusions that are provided in each of the plurality of semiconductor blocks and that penetrate the second semiconductor layer and the active layer to be connected to the first semiconductor layer, and wherein the second electrode is connected to the second semiconductor layer in each of the plurality of semiconductor blocks and has an external connector that is exposed on the bottom of the groove.

Abstract: The light emitting element including: a semiconductor laminate including a first layer, an active layer and a second layer; a first electrode including protrusions that penetrate the second layer and the active layer, the first electrode connected to the first layer via the protrusions; a second electrode connected to the second layer on an lower face of the second layer; and an insulation film between the protrusions and the semiconductor laminate, wherein the protrusions each include a protrusion body covered with the insulation film and a protrusion tip, an upper face and a side face of the protrusion tip being exposed from the insulation film, the first layer includes recesses arranged on an upper face of the first layer so as to sandwich first areas located above the respective the protrusions, and a distance between the recesses sandwiching the first area is larger than a width of the protrusion tip.

Abstract: To provide a semiconductor light emitting element with high luminous efficiency, the light emitting element includes: a substrate; a semiconductor laminate placed above the substrate, the semiconductor laminate comprising a second semiconductor layer, an active layer and a first semiconductor layer laminated in this order from the substrate; and a first electrode and a second electrode placed between the substrate and the semiconductor laminate, wherein the semiconductor laminate is divided in a plurality of semiconductor blocks by a groove, wherein the first electrode includes protrusions that are provided in each of the plurality of semiconductor blocks and that penetrate the second semiconductor layer and the active layer to be connected to the first semiconductor layer, and wherein the second electrode is connected to the second semiconductor layer in each of the plurality of semiconductor blocks and has an external connector that is exposed on the bottom of the groove.

Abstract: The light emitting element including: a semiconductor laminate including a first layer, an active layer and a second layer; a first electrode including protrusions that penetrate the second layer and the active layer, the first electrode connected to the first layer via the protrusions; a second electrode connected to the second layer on an lower face of the second layer; and an insulation film between the protrusions and the semiconductor laminate, wherein the protrusions each include a protrusion body covered with the insulation film and a protrusion tip, an upper face and a side face of the protrusion tip being exposed from the insulation film, the first layer includes recesses arranged on an upper face of the first layer so as to sandwich first areas located above the respective the protrusions, and a distance between the recesses sandwiching the first area is larger than a width of the protrusion tip.

Abstract: A semiconductor light emitting device having high reliability and excellent light distribution characteristics can be provided with an n-electrode arranged on a light extraction surface on the side opposite to the surface whereupon a semiconductor stack is mounted on a substrate. A plurality of convexes are arranged on a first convex region and a second convex region on the light extraction surface. The second convex region adjoins the interface between the n-electrode and the semiconductor stack, between the first convex region and the n-electrode. The base end of the first convex arranged in the first convex region is positioned closer to a light emitting layer than the interface between the n-electrode and the semiconductor stack, and the base end of the second convex arranged in the second convex region is positioned closer to the interface between the n-electrode and the semiconductor stack than the base end of the first convex.

Abstract: A capacitance type touch screen includes a cover lens and a film sensor. The film sensor includes a base film, first transparent electrodes arranged side by side extending in an A direction, second transparent electrodes insulated from the first electrodes and arranged side by side extending in B direction while crossing the first electrodes, a plurality of first lead wirings connected to the first electrodes and drawn to connection terminals, and a plurality of second lead wirings connected to the second electrodes and drawn to connection terminals. The first and second wirings are hidden by the cover lens decorated area. The film sensor includes a top-plate-corresponding-portion facing the cover lens top plate rear surface, and rising portions facing a rear surface of at least one of the first and second side plates. All or most of the second wirings is positioned in the rising portions.

Abstract: A protocol conversion device includes: a first protocol control unit transmitting/receiving first protocol data using a first protocol with information corresponding to a set operation mode to/from a first electronic device connected to a relay device and in which connection adjustment is performed by the first protocol; and a second protocol control unit converting second protocol data received through the relay device from a second electronic device connected to the relay device and in which communication is performed by a second protocol into the first protocol data to transmit the data to the first protocol control unit, and converting the first protocol data received by the first protocol control unit through the relay device into the second protocol data to transmit the data to the second electronic device.

Abstract: There is provided a focus control apparatus including: an information acquisition unit that acquires focal distance information of a predetermined position on a 2-dimensional map using the 2-dimensional map of focal distances; and a focus control unit that performs focus control based on the focal distance information which is acquired by the information acquisition unit.

Abstract: A method of manufacturing a semiconductor light emitting element includes preparing a semiconductor stacked layer structure by stacking a first semiconductor layer and a second semiconductor layer in this order, forming a second electrode and an insulating layer in this order on the second semiconductor layer, exposing the first semiconductor layer by removing a part of the second semiconductor layer, forming a first electrode by forming a metal layer on the exposed first semiconductor layer and the insulating layer and flattening a surface of the metal layer, forming a first electrode-side bonding layer having a top layer made of Au on the first electrode, preparing a support substrate including a support substrate-side bonding layer having a top surface made of Au, and bonding the first electrode-side bonding layer and the support substrate-side bonding layer.

Abstract: A method for fabricating a semiconductor light emitting device is provided. The method includes forming a semiconductor light emitting portion including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and a light emitting layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. The method also includes forming a first conductivity-type semiconductor side electrode connected to the first conductivity-type semiconductor layer; forming a second conductivity-type semiconductor side electrode connected to the second conductivity-type semiconductor layer; and forming an insulator film covering the semiconductor light emitting portion, such that a first portion of the insulator film is surrounded by the second conductivity-type semiconductor side electrode and is separated from the second conductivity-type semiconductor side electrode by a separation area.