Patents by Inventor Hiroaki Mouri

Hiroaki Mouri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8087296
    Abstract: An angular velocity sensor includes a substrate having an upper surface having a first recess provided therein, an electronic component mounted in the first recess, and a vibration element mounted onto the upper surface of the substrate. The first vibration element has a portion located directly above the electronic component. This angular velocity sensor has a small size.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: January 3, 2012
    Assignee: Panasonic Corporation
    Inventors: Shinjiro Ueda, Hiroaki Mouri, Koichiro Nakashima
  • Publication number: 20090165557
    Abstract: An angular velocity sensor includes a substrate having an upper surface having a first recess provided therein, an electronic component mounted in the first recess, and a vibration element mounted onto the upper surface of the substrate. The first vibration element has a portion located directly above the electronic component. This angular velocity sensor has a small size.
    Type: Application
    Filed: March 7, 2007
    Publication date: July 2, 2009
    Inventors: Shinjiro Ueda, Hiroaki Mouri, Koichiro Nakashima
  • Patent number: 7377178
    Abstract: The present invention provides a strain detector improved in output characteristic, in which no internal stress is generated in strain resistance elements even with it fixed on a fixing member. The strain detector is configured in that a detection hole is provided nearly at the center of a insulating substrate, a fixing hole is formed at the position of peripheral end, a portion around the detection hole is pressed by a pressing member, one holding member and the other holding member are provided with fixing holes opposing to the fixing holes of the insulating substrate, and the peripheral end of the insulating substrate is fixed by the fixing member inserted. Accordingly, the detection hole in the insulating substrate is peripherally displaceable in a vertical direction with respect to one holding member and the other holding member.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: May 27, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasunobu Kobayashi, Shigehiro Yoshiuchi, Yasunori Matsukawa, Hiroaki Mouri, Kazuhiko Miyagoshi
  • Publication number: 20070084294
    Abstract: The present invention provides a strain detector improved in output characteristic, in which no internal stress is generated in strain resistance elements even with it fixed on a fixing member. The strain detector is configured in that a detection hole is provided nearly at the center of a insulating substrate, a fixing hole is formed at the position of peripheral end, a portion around the detection hole is pressed by a pressing member, one holding member and the other holding member are provided with fixing holes opposing to the fixing holes of the insulating substrate, and the peripheral end of the insulating substrate is fixed by the fixing. member inserted. Accordingly, the detection hole in the insulating substrate is peripherally displaceable in vertical direction with respect to one holding member and the other holding member.
    Type: Application
    Filed: September 8, 2004
    Publication date: April 19, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yasunobu Kobayashi, Shigehiro Yoshiuchi, Yasunori Matsukawa, Hiroaki Mouri, Kazuhiko Miyagoshi
  • Patent number: 6659334
    Abstract: There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: December 9, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroaki Mouri, Joji Shibata
  • Publication number: 20020066776
    Abstract: There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.
    Type: Application
    Filed: September 19, 2001
    Publication date: June 6, 2002
    Inventors: Hiroaki Mouri, Joji Shibata
  • Patent number: 5581032
    Abstract: In an angular velocity sensor device, a vibration isolation member, a sensor support plate on which a tuning fork unit functioning as a vibrating type angular velocity sensor is mounted, a collar, a circuit board on which a circuit pattern is formed for driving the tuning fork unit and processing a signal output therefrom are provided by having a plurality of pins inserted, in this order, which extend from the bottom surface of a concave-shaped case. The circuit pattern and the tuning fork unit are connected with each other via a flexible printed circuit board. These components are accommodated inside the concave-shaped case. A cover is fitted in an open top of the case so as to completely seal the case. The angular velocity sensor device with the aforementioned arrangement does not suffer variation in the operational properties due to disturbance vibration and deterioration in the vibration isolation property.
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: December 3, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Uemura, Toshihiko Ichinose, Jiro Terada, Masaharu Ushihara, Junichi Yukawa, Hiroaki Mouri, Hideo Ohkoshi, Masayoshi Murakami