Patents by Inventor Hiroaki Nishimura

Hiroaki Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12702192
    Abstract: A shoe includes a sole with a midsole, and an upper portion joined to the sole. The midsole includes a cut having a linear shape, and a depth from a first height position to a second height position in a thickness direction. The cut is configured such that a part of the cut has no contact point with an other part of the cut, and the cut forms a V shape at the deepest part on a cross section when opposite inner walls of the cut are spaced from each other.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: August 11, 2026
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Hiroaki Nishimura, Takayuki Kogure, Yoshikazu Mitsuhata, Hiromichi Otake
  • Publication number: 20260060367
    Abstract: A plate is used for a sole that forms a part of a shoe. The plate includes a mid- and rear-foot support portion in a shape extending from a position superimposed on a rear end portion of a metatarsal bone of a wearer of the shoe in a thickness direction of the sole to a position superimposed on a heel bone of the wearer, the mid- and rear-foot support portion supporting a midfoot portion and a rear foot portion of the wearer. The mid- and rear-foot support portion is in a shape convex upward in a cross-section in a foot width direction.
    Type: Application
    Filed: November 10, 2025
    Publication date: March 5, 2026
    Inventors: Kenta TATENO, Kenji HIRATA, Hiroaki NISHIMURA, Takayuki KOGURE
  • Patent number: 12490799
    Abstract: A plate is used for a sole that forms a part of a shoe. The plate includes a mid- and rear-foot support portion in a shape extending from a position superimposed on a rear end portion of a metatarsal bone of a wearer of the shoe in a thickness direction of the sole to a position superimposed on a heel bone of the wearer, the mid- and rear-foot support portion supporting a midfoot portion and a rear foot portion of the wearer. The mid- and rear-foot support portion is in a shape convex upward in a cross-section in a foot width direction.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: December 9, 2025
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Kenji Hirata, Hiroaki Nishimura, Takayuki Kogure
  • Patent number: 12383026
    Abstract: A shoe sole includes a body portion and a heel holding portion. The heel holding portion is located opposite to a ground contact surface of the body portion and holds a heel portion of a foot at least from a medial foot side. The body portion includes a low hardness portion and a high hardness portion. The high hardness portion is a foam material harder than a foam material of the low hardness portion. The heel holding portion is a resin harder than the foam material of the low hardness portion and the foam material of the high hardness portion. On the medial foot side in a rear foot portion, the low hardness portion is located between the heel holding portion and the high hardness portion in an up-down direction.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: August 12, 2025
    Assignee: ASICS CORPORATION
    Inventors: Hiroki Nakamura, Keishi Kitamoto, Yuji Tamakoshi, Seiji Yano, Shingo Masumoto, Shuhei Takemura, Hiroaki Nishimura, Naoki Sakajo, Seigo Nakaya, Kazunaga Nakayama
  • Publication number: 20250241404
    Abstract: A shoe sole includes a cushion layer, an upper-side plate, and a lower-side plate. The cushion layer includes: a first region configured to support a metatarsophalangeal (MP) joint of a foot of a wearer; and a second region included in a portion located on a rear side with respect to the first region and located on a front side with respect to the rearfoot portion. The second region includes: a third region located in a central portion in a left-right direction; a fourth region located in a medial foot-side end portion in the left-right direction; and a fifth region located in a lateral foot-side end portion in the left-right direction. The fourth region and the fifth region are lower in compression rigidity than the first region, and the third region is lower in compression rigidity than the fourth region and the fifth region.
    Type: Application
    Filed: January 22, 2025
    Publication date: July 31, 2025
    Inventors: Hiromichi OTAKE, Masanori SAKAMOTO, Hiroaki NISHIMURA, Fumitomo HISHIKAWA, Hiroyuki TAKANO
  • Patent number: 12349767
    Abstract: A sole includes a midsole. The midsole includes: a first support portion that is configured to support a front portion of an MP joint of a wearer's foot; and a second support portion that is configured to support a rear portion of the MP joint of the wearer's foot, the second support portion having a shape extending rearward from the first support portion in a foot length direction. The first support portion has an elastic modulus lower than an elastic modulus of the second support portion. The midsole includes a thenar region surrounded by a first portion, a second portion, a third portion, and a fourth portion. A boundary portion between the first support portion and the second support portion passes through the thenar region.
    Type: Grant
    Filed: September 1, 2023
    Date of Patent: July 8, 2025
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Masanori Sakaguchi, Hiroaki Nishimura
  • Patent number: D1084621
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: July 22, 2025
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Takayuki Kogure, Kenta Tateno
  • Patent number: D1084628
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: July 22, 2025
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Kenta Tateno, Takayuki Kogure
  • Patent number: D1084630
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: July 22, 2025
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Kenta Tateno, Takayuki Kogure
  • Patent number: D1087575
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: August 12, 2025
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Takayuki Kogure, Kenta Tateno, Yoshikazu Mitsuhata
  • Patent number: D1116388
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: March 10, 2026
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Takayuki Kogure, Kenji Hirata
  • Patent number: D1116392
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: March 10, 2026
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Hiroaki Nishimura
  • Patent number: D1116393
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: March 10, 2026
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Hiroaki Nishimura
  • Patent number: D1118126
    Type: Grant
    Filed: September 1, 2023
    Date of Patent: March 17, 2026
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Hiroaki Nishimura, Fumitomo Hishikawa, Hiroyuki Takano, Hiromichi Otake
  • Patent number: D1119215
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: March 24, 2026
    Assignee: ASICS CORPORATION
    Inventors: Fumitomo Hishikawa, Hiroaki Nishimura, Shingo Takashima, Yuya Kozuka
  • Patent number: D1119236
    Type: Grant
    Filed: August 12, 2023
    Date of Patent: March 24, 2026
    Assignee: ASICS CORPORATION
    Inventors: Hiromichi Otake, Hiroyuki Takano, Fumitomo Hishikawa, Hiroaki Nishimura
  • Patent number: D1123341
    Type: Grant
    Filed: August 12, 2023
    Date of Patent: April 28, 2026
    Assignee: ASICS CORPORATION
    Inventors: Hiromichi Otake, Hiroyuki Takano, Fumitomo Hishikawa, Hiroaki Nishimura
  • Patent number: D1125812
    Type: Grant
    Filed: August 12, 2023
    Date of Patent: May 12, 2026
    Assignee: ASICS CORPORATION
    Inventors: Fumitomo Hishikawa, Hiroyuki Takano, Hiroaki Nishimura, Hiromichi Otake
  • Patent number: D1133445
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: July 14, 2026
    Assignee: ASICS CORPORATION
    Inventors: Kenta Tateno, Hiroaki Nishimura
  • Patent number: D1145315
    Type: Grant
    Filed: May 31, 2024
    Date of Patent: September 1, 2026
    Assignee: ASICS CORPORATION
    Inventors: Hiroaki Nishimura, Yoshikazu Mitsuhata, Naoki Sakajo, Kenta Wakaida, Kenji Umehara