Abstract: A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.