Patents by Inventor Hiroaki OKI

Hiroaki OKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10215512
    Abstract: [Problem] To provide a heat spreader capable of removing heat from an element more efficiently and immediately than an existing one, and also capable of satisfactorily responding to further enhancement in performance and output of various apparatuses, and a method for efficiently manufacturing the same. [Solution] A heat spreader includes a Cu—Mo layer made of a Cu—Mo composite material and having an average thickness of less than or equal to 0.6 mm and a variation in thickness of less than or equal to 0.1 mm, and a Cu layer directly stacked on each of both surfaces thereof. A method for manufacturing the heat spreader includes planarizing a plate material of the Cu—Mo composite material constituting the Cu—Mo layer, and roll-bonding a Cu plate constituting the Cu layer to each of both surfaces thereof.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: February 26, 2019
    Assignee: A.L.M.T. Corp.
    Inventors: Hiroaki Oki, Tadashi Arikawa, Shouichi Inaba
  • Publication number: 20170198991
    Abstract: [Problem] To provide a heat spreader capable of removing heat from an element more efficiently and immediately than an existing one, and also capable of satisfactorily responding to further enhancement in performance and output of various apparatuses, and a method for efficiently manufacturing the same. [Solution] A heat spreader includes a Cu—Mo layer made of a Cu—Mo composite material and having an average thickness of less than or equal to 0.6 mm and a variation in thickness of less than or equal to 0.1 mm, and a Cu layer directly stacked on each of both surfaces thereof. A method for manufacturing the heat spreader includes planarizing a plate material of the Cu—Mo composite material constituting the Cu—Mo layer, and roll-bonding a Cu plate constituting the Cu layer to each of both surfaces thereof.
    Type: Application
    Filed: May 13, 2015
    Publication date: July 13, 2017
    Inventors: Hiroaki OKI, Tadashi ARIKAWA, Shouichi INABA