Abstract: The polishing apparatus includes: a holding section that holds a material to be polished; the polishing body that polishes the material to be polished held by the holding section; the head that supports the polishing body via the elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; and a control unit that is connected to the driving mechanism and controls the driving mechanism. A load measurement device to measure a load applied to the polishing body is attached to the head, and the load measurement device is connected to the polishing body via the elastic mechanism.

Abstract: A polishing apparatus includes: a holding section that holds a material to be polished; a polishing body that polishes the material to be polished held by the holding section; a head that supports the polishing body via an elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; a control unit that controls the driving mechanism; and a position sensor that measures a position of the polishing body with respect to the head. The load control is performed based on a measurement value of the position sensor and a spring constant value of the elastic mechanism.

Abstract: To provide a polishing apparatus capable of avoiding an overshoot with respect to a target load at the time of polishing, which is caused when position control is switched to load control in the polishing apparatus of a type where a polishing body is supported by a head via an elastic mechanism. A polishing apparatus includes: a holding section that holds a material to be polished; a polishing body that polishes the material to be polished held by the holding section; a head that supports the polishing body via an elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; a control unit that controls the driving mechanism; and a position sensor that measures a position of the polishing body with respect to the head. The load control is performed based on a measurement value of the position sensor and a spring constant value of the elastic mechanism.

Abstract: The polishing apparatus includes: a holding section that holds a material to be polished; the polishing body that polishes the material to be polished held by the holding section; the head that supports the polishing body via the elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; and a control unit that is connected to the driving mechanism and controls the driving mechanism. A load measurement device to measure a load applied to the polishing body is attached to the head, and the load measurement device is connected to the polishing body via the elastic mechanism.