Patents by Inventor Hiroaki SAI

Hiroaki SAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9895714
    Abstract: A film comprising a crystalline halide perovskite composition having the following formula: AMX3??(1) wherein: A is an organic cation selected from the group consisting of methylammonium, tetramethylammonium, formamidinium, and guanidinium; M is at least one divalent metal; and X is independently selected from halide atoms; wherein the crystalline film of the halide perovskite composition possesses at least one of an average grain size of at least 30 microns, substantial crystal orientation evidenced in an ordering parameter of at least 0.6, and a level of crystallinity of at least 90%. Methods for producing films of these halide perovskite compositions using ionic liquids instead of volatile organic solvents are also described herein.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 20, 2018
    Assignee: CORNELL UNIVERSITY
    Inventors: David T. Moore, Hiroaki Sai, Kwan Wee Tan, Lara A. Estroff, Ulrich B. Wiesner
  • Publication number: 20160251303
    Abstract: A film comprising a crystalline halide perovskite composition having the following formula: AMX3 ??(1) wherein: A is an organic cation selected from the group consisting of methylammonium, tetramethylammonium, formamidinium, and guanidinium; M is at least one divalent metal; and X is independently selected from halide atoms; wherein the crystalline film of the halide perovskite composition possesses at least one of an average grain size of at least 30 microns, substantial crystal orientation evidenced in an ordering parameter of at least 0.6, and a level of crystallinity of at least 90%. Methods for producing films of these halide perovskite compositions using ionic liquids instead of volatile organic solvents are also described herein.
    Type: Application
    Filed: February 26, 2016
    Publication date: September 1, 2016
    Inventors: David T. MOORE, Hiroaki SAI, Kwan Wee TAN, Lara A. Estroff, Ulrich B. Wiesner