Patents by Inventor Hiroaki Sawa

Hiroaki Sawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rubber molded product
    Patent number: 6037397
    Abstract: A rubber molded product containing an inorganic filler, in which the relation of an inorganic filler content and a thermal resistance is within the range enclosed by lines connecting points A (20,1.5), B (20,0.1) and C (50,0.1) in the X-Y coordinates wherein the X coordinate expresses the inorganic filler content (vol %) and the Y coordinate expresses the thermal resistance per 1 mm thickness (.degree. C./W).
    Type: Grant
    Filed: June 25, 1998
    Date of Patent: March 14, 2000
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Mikitoshi Satoh, Tsutomu Yamaguchi, Hiroaki Sawa, Kazuyoshi Ikeda, Masato Nishikawa
  • Radiating spacer, its use and silicone composition
    Patent number: 5978221
    Abstract: A radiating spacer consisting essentially of a silicone solidified product containing a heat conductive filler, said spacer having a thermal conductivity of at least 0.8 W/m.multidot.K and a compressibility of at least 10% under a load of 30 g/cm.sup.2.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: November 2, 1999
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroaki Sawa, Masato Nishikawa, Mikitoshi Sato, Kazuyoshi Ikeda