Abstract: A reductant container having: a tank main body that accommodates a reductant; a heating member disposed in the tank main body and configured to generate heat so as to increase a temperature of the reductant; a covering member covering the heating member and having an inflow portion, the inflow portion allowing some of the reductant to flow into the covering member; a reductant supply pipe through which the reductant in the covering member is supplied to the outside of the tank main body; and a temperature measuring unit having a temperature sensor disposed in the covering member to sense a temperature of the reductant, the temperature measuring unit determining the temperature sensed by the temperature sensor, wherein the covering member has an upper wall covering the heating member from above, the upper wall having a lower surface that is inclined so as to be raised toward the temperature sensor.

Abstract: A reductant container having: a tank main body that accommodates a reductant; a heating member disposed in the tank main body and configured to generate heat so as to increase a temperature of the reductant; a covering member covering the heating member and having an inflow portion, the inflow portion allowing some of the reductant to flow into the covering member; a reductant supply pipe through which the reductant in the covering member is supplied to the outside of the tank main body; and a temperature measuring unit having a temperature sensor disposed in the covering member to sense a temperature of the reductant, the temperature measuring unit determining the temperature sensed by the temperature sensor, wherein the covering member has an upper wall covering the heating member from above, the upper wall having a lower surface that is inclined so as to be raised toward the temperature sensor.

Abstract: Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part.