Abstract: As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.

Abstract: As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.

Abstract: A method for preparing a cyclic olefin addition polymer of high gas permeability, which method including subjecting a specific type of cyclic olefin-functional siloxane and a mixture thereof with a specific type of cyclic olefin compound to addition polymerization in the presence of a multi-component catalyst containing (A) a zero-valent palladium compound, (B) an ionic boron compound, and (C) a phosphine compound having a substituent group selected from an alkyl group having 3 to 6 carbon atoms, a cycloalkyl group and an aryl group, to obtain a cyclic olefin addition polymer of high gas permeability wherein a ratio of the structural units derived from the cyclic olefin-functional siloxane is at 10 to 100 mole % of the addition polymer and a number average molecular weight (Mn) ranges from 100,000 to 2,000,000.

Abstract: A method for preparing a cyclic olefin addition polymer of high gas permeability, which method including subjecting a specific type of cyclic olefin-functional siloxane and a mixture thereof with a specific type of cyclic olefin compound to addition polymerization in the presence of a multi-component catalyst containing (A) a zero-valent palladium compound, (B) an ionic boron compound, and (C) a phosphine compound having a substituent group selected from an alkyl group having 3 to 6 carbon atoms, a cycloalkyl group and an aryl group, to obtain a cyclic olefin addition polymer of high gas permeability wherein a ratio of the structural units derived from the cyclic olefin-functional siloxane is at 10 to 100 mole % of the addition polymer and a number average molecular weight (Mn) ranges from 100,000 to 2,000,000.

Abstract: Disclosed herein is a cosmetic product which contains a polymer having the repeating unit represented by the following formula (1) or (2): wherein R1 is independently alkyl group having 1 to 12 carbon atoms, X is a group represented by the following formula (i), a is an integer of 1 to 3, and b is an integer of 0 to 2, wherein R2 is independently alkyl group having 1 to 12 carbon atoms and c is an integer of 1 to 5, wherein R1, R2, and b are defined as above, and d is an integer of 2 to 5.

Abstract: A cycloolefin addition polymer is prepared by addition polymerization of a cycloolefin-functionalized siloxane and optionally norbornene in the presence of catalyst A which is a nickel or palladium complex having a cyclopentadienyl ligand and a methyl, triphenylphosphine or allyl ligand and co-catalyst B, typically tris(pentafluorophenyl)boron or trityltetra(pentafluorophenyl)borate. The polymer is easy to manufacture and has high thermal stability and mechanical strength as well as good gas permeability.

Abstract: A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4?a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8?a?2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).

Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 ?m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 ?m.

Abstract: A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4?a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8?a?2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).

Abstract: The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa·s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.

Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &mgr;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &mgr;m.

Abstract: This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25° C. before curing is 10-1000 Pa·s, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps.