Abstract: An optical detecting apparatus includes a light source, a receiving unit and a first optical element. The light source is configured to emit first light. The receiving unit includes a light splitting portion and a sensing portion, wherein the light splitting portion is configured to separate second light with a predetermined bandwidth from the first light, the sensing portion is configured to receive the second light with the predetermined bandwidth, and the light splitting portion and the sensing portion are connected. The first optical element is disposed between the light source and the receiving unit and is configured to converge or collimate the first light.

Abstract: A plurality of magnetoresistive heads are arranged on a wafer substrate. A plurality of electrode pads are arranged on the wafer substrate in a first direction. Each electrode pad is connected to an associated magnetoresistive head. Respective adjacent electrode pads are shifted from each other in a second direction perpendicular to the first direction. The shifted amount of the adjacent pads in the second direction is larger than a dimension of the electrode pad in the second direction.

Abstract: A plurality of magnetic head elements, each having a terminal portion, are arranged on a first face of the head chip. A wiring board member is electrically connected to the respective terminal portions of the magnetic head elements. A pair of side chips sandwich the head chip from both sides of the first face. Each of the side chips has faces forming a recessed portion which faces with at least the terminal portions of the magnetic head elements.

Abstract: A plurality of magnetic head elements, each having a terminal portion, are arranged on a first face of the head chip. A wiring board member is electrically connected to the respective terminal portions of the magnetic head elements. A pair of side chips sandwich the head chip from both sides of the first face. Each of the side chips has faces forming a recessed portion which faces with at least the terminal portions of the magnetic head elements.

Abstract: A plurality of magnetoresistive heads are arranged on a wafer substrate. A plurality of electrode pads are arranged on the wafer substrate in a first direction. Each electrode pad is connected to an associated magnetoresistive head. Respective adjacent electrode pads are shifted from each other in a second direction perpendicular to the first direction. The shifted amount of the adjacent pads in the second direction is larger than a dimension of the electrode pad in the second direction.