Patents by Inventor Hiroaki Tomimoto

Hiroaki Tomimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7232276
    Abstract: A paved road including a reinforcement sheet layer (1A) and a pavement layer (22), in which the reinforcement sheet layer (1A) includes an asphalt layer (2) laminated to at least one side of a reinforcement sheet (1) including a composite material that is impregnated with a thermoplastic resin to achieve a volume content of a continuous glass fiber, which is a reinforcement fiber, of not less than 30% and not moere than 85% is proved.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: June 19, 2007
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Oka, Hiroaki Tomimoto, Kazuaki Kouda, Sachio Yokote, Yoshiharu Miyasaka, Yoshitaka Hoya, Takashi Iiyama
  • Publication number: 20030086762
    Abstract: A paved road including a reinforcement sheet layer (1A) and a pavement layer (22), in which said reinforcement sheet layer (1A) includes an asphalt layer (2) laminated to at least one side of a reinforcement sheet (1) including a composite material that is impregnated with a thermoplastic resin so that a volume content of a continuous glass fiber is not less than 30% and not more than 85% using the continuous glass fiber as reinforcement fiber is provided. The paved road shows remarkably excellent durability to rutting and crack, and a thin surfacing (thin layer pavement) paving with thickness of asphalt made thinner becomes possible.
    Type: Application
    Filed: June 17, 2002
    Publication date: May 8, 2003
    Inventors: Atsushi Oka, Hiroaki Tomimoto, Kazuaki Kouda, Sachio Yokote, Yoshiharu Miyasaka, Yoshitaka Hoya, Takashi Iiyama
  • Patent number: 5580918
    Abstract: A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by the following formula (1): ##STR1## wherein X represents a direct bond, a hydrocarbon group, a carbonyl group, a thio group or so, Y.sub.1 -Y.sub.4 individually represent a hydrogen atom, a lower alkyl group or so and R.sub.1 represents an aliphatic group, an aromatic group or so; and 50-5 parts by weight of a polyetheretherketone, said composition having been subjected to heat treatment at 250.degree.-330.degree. C. and, after the heat-treatment, having crystallization enthalpy of 0-6 cal/g.The heat treatment of the polyimide resin composition can be effected at a low temperature in a short time. The polyimide resin composition has excellent dimensional stability and high-temperature physical properties. Moreover, it has excellent moldability and peeling resistance.
    Type: Grant
    Filed: February 16, 1994
    Date of Patent: December 3, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Atsushi Morita, Yoshihisa Gotoh, Toshiaki Takahashi, Kayako Ito, Hiroyasu Oochi, Tomohito Koba, Katunori Simamura, Hiroaki Tomimoto, Nobuhiro Takizawa
  • Patent number: 5473010
    Abstract: The present invention relates to a polyimide based resin composition comprises 1 to 50 parts by weight of polyetherimide for 100 parts by weight a resin composition comprising 50 to 99 parts by weight of polyarylether ketone and 50 to 1 parts by weight of polyimide having specific structural units.The polyimide based resin compositions have excellent fatigue characteristics and creep resistance and are expected widely to apply in field of machine and automobile parts which is required permanence for mechanical strength.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: December 5, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Atsushi Morita, Tomohito Koba, Toshiaki Takahashi, Katsunori Shimamura, Toshiyuki Kataoka, Hiroyuki Furukawa, Hiroaki Tomimoto