Patents by Inventor Hiroaki Tomita

Hiroaki Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942539
    Abstract: A semiconductor device includes a polycrystalline silicon part buried in a termination region of a silicon layer. The polycrystalline silicon part contacts the silicon layer, has a higher crystal grain density than the silicon layer, and includes a heavy metal. The silicon layer includes a drift layer located in a cell region and the termination region. The drift layer has a lower first-conductivity-type impurity concentration than a silicon substrate. The drift layer includes a same element of heavy metal as the heavy metal included in the polycrystalline silicon part.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 26, 2024
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Shotaro Baba, Hiroaki Katou, Yuhki Fujino, Kouta Tomita
  • Publication number: 20240077772
    Abstract: A display device includes: a first substrate, a second substrate, a light-blocking portion, a pixel, and a wiring line. The second substrate has a main face opposite a main face of the first substrate. The light-blocking portion is disposed on the main face of the first substrate, including an opening, and blocking light. The pixel is disposed on the main faces of the first substrate and the second substrate and delimited by at least a part of the opening. The wiring line is disposed on the main face of the second substrate and at least partially overlapping the opening. The wiring line has a projection protruding toward a first substrate side. The projection has a surface including a curved surface and comprises a plurality of projections disposed at intervals in locations overlapping at least the opening.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Inventors: Hiroaki WADA, Junichi MORI, Takumi TOMITA, Kenichi NISHIMURA, Hiroto AKIYAMA
  • Patent number: 9849743
    Abstract: A swing arm having a reduced number of parts in which manufacturing cost can be reduced. In a swing arm including: vehicle-body-side support portions that are supported on a vehicle body side by a first rotary shaft; wheel-side support portions that are supported on a wheel side by a second rotary shaft; and a pair of arm portions that connect the vehicle-body-side support portions and the wheel-side support portions to each other, cross members that extend in an axial direction of the first rotary shaft is arranged on the pair of arm portions so as to extend between the pair of arm portions, and the cross members have a U shape in cross section orthogonal to a longitudinal direction of the cross members, thus forming opening portions that open so as to face a direction that the pair of arm portions extends.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: December 26, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Naoki Kuwabara, Hiroaki Tomita, Hajime Uchiyama
  • Patent number: 9428031
    Abstract: A vehicle-use pivotally-supporting portion structure includes a cylindrical upper pivotally-supporting portion; a tubular bushing mounted on a radially inner side of an end portion of the upper pivotally-supporting portion; and a sealing member mounted on a radially outer side of the end portion of the upper pivotally-supporting portion. A flange portion, which extends outward in a radial direction and is brought into contact with a distal end of the upper pivotally-supporting portion, is formed on an end portion of the tubular bushing, and an outer diameter of the flange portion is larger than an outer diameter of the end portion of the upper pivotally-supporting portion.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 30, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Naoki Kuwabara, Hiroaki Tomita
  • Publication number: 20160089944
    Abstract: A swing arm having a reduced number of parts in which manufacturing cost can be reduced. In a swing arm including: vehicle-body-side support portions that are supported on a vehicle body side by a first rotary shaft; wheel-side support portions that are supported on a wheel side by a second rotary shaft; and a pair of arm portions that connect the vehicle-body-side support portions and the wheel-side support portions to each other, cross members that extend in an axial direction of the first rotary shaft is arranged on the pair of arm portions so as to extend between the pair of arm portions, and the cross members have a U shape in cross section orthogonal to a longitudinal direction of the cross members, thus forming opening portions that open so as to face a direction that the pair of arm portions extends.
    Type: Application
    Filed: August 20, 2015
    Publication date: March 31, 2016
    Inventors: Naoki Kuwabara, Hiroaki Tomita, Hajime Uchiyama
  • Publication number: 20150210139
    Abstract: A vehicle-use pivotally-supporting portion structure includes a cylindrical upper pivotally-supporting portion; a tubular bushing mounted on a radially inner side of an end portion of the upper pivotally-supporting portion; and a sealing member mounted on a radially outer side of the end portion of the upper pivotally-supporting portion. A flange portion, which extends outward in a radial direction and is brought into contact with a distal end of the upper pivotally-supporting portion, is formed on an end portion of the tubular bushing, and an outer diameter of the flange portion is larger than an outer diameter of the end portion of the upper pivotally-supporting portion.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 30, 2015
    Inventors: Naoki Kuwabara, Hiroaki Tomita
  • Publication number: 20140274542
    Abstract: A locking collar for association with a differential and configured to facilitate operation of vehicle in one of a two-wheel drive mode, a four-wheel drive mode, and a four-wheel drive mode with a locked differential is provided. The locking collar includes a first set of internal splines.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Dustin Schroeder, Bunzo Seki, Masahiro Yamaguchi, Shinya Nishiyama, Hiroaki Tomita
  • Patent number: 8796869
    Abstract: In a CSP type semiconductor device, the invention prevents a second wiring from forming a narrowed portion on a lower surface of a step portion at the time of forming the second wiring that is connected to the back surface of a first wiring formed near a side surface portion of a semiconductor die on the front surface and extends onto the back surface of the semiconductor die over the step portion of a window that is formed from the back surface side of the semiconductor die so as to expose the back surface of the first wiring. A glass substrate is bonded on a semiconductor substrate on which a first wiring is formed on the front surface near a dicing line with an adhesive resin being interposed therebetween. The semiconductor substrate is then etched from the back surface to form a window having step portions with inclined sidewalls around the dicing line as a center.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: August 5, 2014
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Hiroaki Tomita, Kazuyuki Suto
  • Patent number: 8598720
    Abstract: A semiconductor device and its manufacturing method are offered to increase the number of semiconductor devices obtained from a semiconductor wafer while simplifying a manufacturing process. After forming a plurality of pad electrodes in a predetermined region on a top surface of a semiconductor substrate, a supporter is bonded to the top surface of the semiconductor substrate through an adhesive layer. Next, an opening is formed in the semiconductor substrate in a region overlapping the predetermined region. A wiring layer electrically connected with each of the pad electrodes is formed in the opening. After that, a stacked layer structure including the semiconductor substrate and the supporter is cut by dicing along a dicing line that is outside the opening.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: December 3, 2013
    Assignees: SANYO Semiconductor Co., Ltd., SANYO Semiconductor Manufacturing Co., Ltd., Semiconductor Components Industries, LLC
    Inventors: Hiroaki Tomita, Kazuyuki Sutou
  • Patent number: 8517142
    Abstract: A steering unit includes a housing, a steering shaft, a bearing, a steering arm, and a stop portion. The housing includes upper and lower portions that cooperate to define an interior. The steering shaft includes an upper and lower end. The bearing is supported by the lower portion of the housing and is disposed at least partially within the interior. The steering shaft is journaled with respect to the lower portion of the housing by the bearing. The steering arm is coupled with the lower end of the steering shaft and is configured for coupling to steerable wheels. The stop portion projects from the lower portion of the housing and into a travel path of the steering arm such that the steering arm selectively contacts the stop portion to prevent over-rotation of the steering shaft. A vehicular frame assembly for supporting the steering unit is also provided.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: August 27, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: L. Tyler Farrar, Jason A. Sovern, Hiroaki Tomita, Bunzo Seki, Hiromitsu Shiina
  • Patent number: 8415298
    Abstract: The present invention provides methods for diagnosing mental disorders. The invention also provides methods of identifying modulators of mental disorders as well as methods of using these modulators to treat patients suffering from mental disorders.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: April 9, 2013
    Assignee: The Board of Trustees of the Leland Stanford Junior University of Stanford
    Inventors: Huda Akil, William E. Bunney, Jr., Prabhakara V. Choudary, Simon J. Evans, Edward G. Jones, Jun Li, Juan F. Lopez, David M. Lyons, Margherita Molnar, Richard M. Myers, Alan F. Schatzberg, Richard Stein, Robert C. Thompson, Hiroaki Tomita, Marquis P. Vawter, Stanley J. Watson
  • Patent number: 8225898
    Abstract: A vehicle includes a vehicle body frame, an internal combustion engine supported on the vehicle body frame, a propeller shaft assembly operatively connected to a crankshaft of the engine, a driveshaft, a final drive unit disposed between the front propeller shaft assembly and the driveshaft, a pair of occupant seats arranged side by side in a vehicle width direction, a pedal cluster, and a reduction gear located rearward of the pedal cluster and frontward of the occupant seats. The propeller shaft assembly includes a first propeller shaft disposed at a rear of the reduction gear, and a second propeller shaft disposed at a front of the reduction gear. The second propeller shaft is offset toward a second seat side in a vehicle width direction with respect to the first propeller shaft.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: July 24, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Naoki Kuwabara, Hiroaki Tomita
  • Patent number: 8193084
    Abstract: When a bump electrode is formed on an opening formed in a semiconductor substrate, the invention prevents a void that is caused by gas trapped in the opening. A method of manufacturing a semiconductor device of the invention includes forming a first wiring on a main surface of a semiconductor substrate, forming an opening in the semiconductor substrate from the back surface to the main surface so as to expose the back surface of the first wiring, forming a second wiring connected to the back surface of the first wiring and extending from inside the opening onto the back surface of the semiconductor substrate, forming a solder layer connected to part of the second wiring on the bottom of the opening and extending from inside the opening onto the back surface of the semiconductor substrate, and forming a bump electrode on the opening by reflowing the solder layer.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: June 5, 2012
    Assignees: Semiconductor Components Industries, LLC, SANYO Semiconductor Co., Ltd., SANYO Semiconductor Manufacturing Co., Ltd.
    Inventors: Kazuyuki Sutou, Hiroaki Tomita
  • Publication number: 20120032307
    Abstract: In a CSP type semiconductor device, the invention prevents a second wiring from forming a narrowed portion on a lower surface of a step portion at the time of forming the second wiring that is connected to the back surface of a first wiring formed near a side surface portion of a semiconductor die on the front surface and extends onto the back surface of the semiconductor die over the step portion of a window that is formed from the back surface side of the semiconductor die so as to expose the back surface of the first wiring. A glass substrate is bonded on a semiconductor substrate on which a first wiring is formed on the front surface near a dicing line with an adhesive resin being interposed therebetween. The semiconductor substrate is then etched from the back surface to form a window having step portions with inclined sidewalls around the dicing line as a center.
    Type: Application
    Filed: August 5, 2011
    Publication date: February 9, 2012
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Hiroaki TOMITA, Kazuyuki Suto
  • Publication number: 20120018849
    Abstract: In a CSP type semiconductor device, the invention prevents a second wiring from forming a protruding portion toward a dicing line at the time of forming the second wiring that is connected to the back surface of a first wiring formed near a side surface portion of a semiconductor die on the front surface and extends onto the back surface of the semiconductor die over a step portion in a window that is formed from the back surface side of the semiconductor die so as to expose the back surface of the first wiring. A glass substrate is bonded on a semiconductor substrate on which a first wiring is formed on the front surface near a dicing line with a resin as an adhesive being interposed therebetween. The semiconductor substrate is then etched from the back surface to form a window having inclined sidewalls with the dicing line as a center.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 26, 2012
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Kazuyuki SUTO, Hiroaki Tomita
  • Publication number: 20110224144
    Abstract: The present invention provides methods for diagnosing mental disorders (e.g., psychotic disorders such as schizophrenia). The invention also provides methods of identifying modulators of such mental disorders as well as methods of using these modulators to treat patients suffering from such mental disorders.
    Type: Application
    Filed: October 12, 2010
    Publication date: September 15, 2011
    Applicant: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Huda Akil, Mary Atz, William E. Bunney, JR., Prabhakara V. Choudary, Simon J. Evans, Edward G. Jones, Jun Li, Juan F. Lopez, Richard Myers, Robert C. Thompson, Hiroaki Tomita, Marquis P. Vawter, Stanley Watson
  • Patent number: 7878293
    Abstract: To make an electrically-operated power steering unit less susceptible to influence of change in a positional relationship between supporting sections respectively at the two ends of the electrically-operated power steering unit. A gear case included in a electrically-operated power steering unit is attached to the lower section of a vehicle body frame, and the lower end portion of a steering shaft is rotatably supported by a housing annexed to the gear case with an upper bearing interposed in between, in a vehicle in which an input shaft provided to the electrically-operated power steering unit is linked to the lower end portion of the steering shaft, and in which an output shaft provided to the electrically-operated power steering unit is rotatably supported by the lower section of a vehicle body.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: February 1, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Megumu Okada, Keita Yagi, Yotaro Mori, Takeshi Wakabayashi, Kihoko Kaita, Hiroaki Tomita
  • Publication number: 20110014610
    Abstract: The present invention provides methods for diagnosing mental disorders (e.g., psychotic disorders such as schizophrenia and mood disorders such as major depression disorder and bipolar disorder). The invention also provides methods of identifying modulators of such mental disorders as well as methods of using these modulators to treat patients suffering from such mental disorders.
    Type: Application
    Filed: February 5, 2010
    Publication date: January 20, 2011
    Applicant: Board of Trustees of the Leland Stanford Junior University
    Inventors: Huda Akil, Mary Atz, William E. Bunney, JR., William Byerley, Kathleen Casey, Prabhakara V. Choudary, Simon J. Evans, Edward G. Jones, Jun Li, Juan F. Lopez, Richard M. Myers, Brandi Rollins, Robert C. Thompson, Hiroaki Tomita, Marquis P. Vawter, Stanley J. Watson
  • Patent number: 7845473
    Abstract: A brake caliper structure of a straddle seat off-load vehicle includes a brake caliper having a caliper bracket, a caliper assembly connected to the caliper bracket by two connecting portions so that the caliper assembly can move relative to the caliper bracket to clamp a brake disc. One connecting portion includes a slide pin connected to the caliper assembly and slidably received in a guide hole in the caliper bracket for effectively guiding movement of the caliper assembly relative to the caliper bracket, and the other connecting portion includes a connecting screw as a fixed pin secured to the caliper bracket, and a rubber bushing as an elastic member disposed between the caliper assembly and the fixed pin for taking up the tilting of the brake disc.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: December 7, 2010
    Assignees: Honda Motor Co., Ltd., Nissin Kogyo Co., Ltd.
    Inventors: Hiroaki Tomita, Makoto Toda, Naoki Takayanagi
  • Patent number: 7744104
    Abstract: A suspension arm and cushion support structure for a vehicle. A knuckle support part of a rear suspension arm is formed of a plate member extended to the vehicle body inner side relative to a rim of a wheel element so as to cover the lower side of a boot covering a connected part between a drive shaft and a universal joint. The knuckle is supported by the rear suspension arm, and rotatably supports a wheel of the vehicle. A cushion is provided for absorbing shocks transmitted to the wheel, the lower end of the cushion being coaxially supported on the knuckle support part of a lower part of the rear suspension arm.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: June 29, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Naoki Kuwabara, Hiroaki Tomita