Patents by Inventor Hiroaki Tsuchida

Hiroaki Tsuchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency module and manufacturing method therefor
    Patent number: 10559535
    Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: February 11, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Yoshihisa Masuda, Hideo Nakagoshi, Yuta Morimoto, Norio Sakai, Yoriyuki Matsumoto, Hiroaki Tsuchida
  • HIGH-FREQUENCY MODULE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20180166394
    Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.
    Type: Application
    Filed: February 9, 2018
    Publication date: June 14, 2018
    Inventors: Yoshihito OTSUBO, Yoshihisa MASUDA, Hideo NAKAGOSHI, Yuta MORIMOTO, Norio SAKAI, Yoriyuki MATSUMOTO, Hiroaki TSUCHIDA
  • Apparatus for phase switching in pumping-up power station
    Patent number: 4211902
    Abstract: Apparatus for phase switching in a pumping-up power station includes a phase switching device to switch over between pumping-up and generating. The phase switching device includes a pair of disconnecting switches for pumping-up and generating integrally accommodated in a sealed casing filled with sulphur hexa-fluoride (SF.sub.6) gas and an actuating mechanism for actuating the disconnecting switches.
    Type: Grant
    Filed: April 20, 1977
    Date of Patent: July 8, 1980
    Assignee: Tokyo Shibaura Electric Co., Ltd.
    Inventor: Hiroaki Tsuchida