Patents by Inventor Hiroaki Umehara

Hiroaki Umehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180250916
    Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.
    Type: Application
    Filed: September 2, 2016
    Publication date: September 6, 2018
    Inventors: AKIHIRO YAMAUCHI, YOSHIAKI ESAKI, TAKAYOSHI OZEKI, HIROAKI UMEHARA, HIROHARU INOUE, YOSHIHIKO NAKAMURA
  • Publication number: 20160168378
    Abstract: A poly(phenylene ether) resin composition includes a modified poly(phenylene ether) copolymer, a polymer substance having a weight-average molecular weight larger than that of the modified poly(phenylene ether) copolymer, and a compound compatible with the modified poly(phenylene ether) copolymer. The modified poly(phenylene ether) copolymer is produced by modifying the phenolic hydroxyl group in a molecular terminal of a poly(phenylene ether) copolymer with a compound having a carbon-carbon unsaturated double bond. The polymer substance has a structure of at least one selected from a polystyrene framework, a polybutadiene framework, and a methacrylate framework. The polymer substance has a softening temperature not higher than 110° C. The compound compatible with the modified poly(phenylene ether) copolymer includes two or more carbon-carbon unsaturated double-bonds per molecule, and has a melting point not higher than 30° C.
    Type: Application
    Filed: December 1, 2015
    Publication date: June 16, 2016
    Inventors: HIROAKI UMEHARA, HIROHARU INOUE
  • Publication number: 20160090457
    Abstract: A prepreg satisfies the following properties (A) and (B). (A) The resin flow of the prepreg measured under conditions of 170° C. and 30 kgf/cm2 according to IEC 60249-3-1, 1981, is 0% or more and 5% or less. (B) In a dynamic viscoelasticity test under conditions of a temperature of 30° C. or higher and 200° C. or lower, a temperature rising rate of 3° C./min, and a frequency of 0.5 Hz, a relation of 1?Vb/Va?15 is established, where Va is a minimum melt viscosity of the resin composition collected from the prepreg, and Vb is a melt viscosity of the collected resin composition at a temperature Tb, Tb=Ta+20° C., and Ta is a temperature when the melt viscosity is the minimum melt viscosity Va.
    Type: Application
    Filed: September 18, 2015
    Publication date: March 31, 2016
    Inventors: HIROAKI UMEHARA, HIROHARU INOUE
  • Publication number: 20150259489
    Abstract: Provided is a prepreg that is formed by impregnating a fabric base material with a resin composition, then heating and drying. The resin composition includes (A) a polymer which has a specific structure, has no unsaturated bond between carbon atoms, has an epoxy number of from 0.2 to 0.8 eq/kg, and has a weight-average molecular weight of from 200,000 to 1,000,000; (B) a polyarylene-ether copolymer (PAE); and (C) an epoxy resin having two or more epoxy groups on a molecule. The component (B) is compatible with the component (A), and the component (C) is an epoxy resin that is incompatible with the component (A).
    Type: Application
    Filed: March 6, 2015
    Publication date: September 17, 2015
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Hiroharu INOUE
  • Patent number: 9125307
    Abstract: The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a polyamide-imide resin. The polyamide-imide resin includes a first constituent unit represented by Formula (1) and a second constituent unit represented by Formula (2). The percentage of the second constituent unit is in a range of 5 to 35% by mol.
    Type: Grant
    Filed: November 22, 2012
    Date of Patent: September 1, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takayoshi Ozeki, Hiroaki Umehara, Yoshiaki Esaki
  • Publication number: 20140326487
    Abstract: The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a polyamide-imide resin. The polyamide-imide resin includes a first constituent unit represented by Formula (1) and a second constituent unit represented by Formula (2). The percentage of the second constituent unit is in a range of 5 to 35% by mol.
    Type: Application
    Filed: November 22, 2012
    Publication date: November 6, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Takayoshi Ozeki, Hiroaki Umehara, Yoshiaki Esaki