Abstract: The present invention relates to a reflective mask blank for EUV lithography, including: a substrate, a multilayer reflective film reflecting EUV light, and a phase shift film shifting a phase of the EUV light, in which the substrate, the multilayer reflective film, and the phase shift film are formed in this order, the phase shift film includes a layer 1 including ruthenium (Ru) and nitrogen (N), and the layer 1 has an absolute value of a film stress of 1,000 MPa or less.

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.

Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.

Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.

Abstract: A printed wiring board includes a laminated base material including a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and the surface conductor layer and/or conductor layer, and a solder resist layer laminated on a surface of the laminated base material such that the solder resist layer is covering the surface conductor layer. The internal bonding layer has a surface in contact with the interlayer insulating layer such that the surface of the internal bonding layer has arithmetic average roughness Ra in a range of 100 nm or more and 300 nm or less, and the surface conductor layer has a surface on a solder resist layer side such that the surface of the surface conductor layer has arithmetic average roughness Ra of less than 100 nm.

Abstract: An information processing apparatus includes: transmission means for transmitting information on an input character to an information managing apparatus along with identification information identifying a process associated with a screen on which the character is input, the information being transmitted as a request for conversion of the input character; reception means for receiving information concerning candidates of words into which the input character can be converted, transmitted by the information managing apparatus in response to the request for conversion thus transmitted; display control means for controlling display of a list of conversion candidates for the input character included in the received information; and selection accepting means for accepting the selection of a result of conversion of the input character from the displayed list of conversion candidates.

Abstract: An electronic device comprising a reception unit configured to receive a television broadcast including a television-program broadcast and a plurality of commercial-message broadcast transmitted during the television-program broadcast. A detecting unit detects whether a commercial-message broadcast is included in the received television broadcast. A recording unit records an image of the received television-program broadcast according to the detecting. A display-control unit produces the image of the received television broadcast and produces a summary image for a predetermined display time during reception of the commercial-message broadcast.

Abstract: The present invention is a data receiving device for receiving data created with a plurality of bits for each frame, and acquiring this data based on a receive side clock, wherein a timing candidate generation section generates at least three clock timings within the bit cycle as candidates of a data acquisition timing, a header read monitoring section reads a data signal at each clock timing of the timing candidate and monitors if the header is correctly read at each clock timing, a timing decision section decides the timing candidate at the center as the data acquisition timing if there are three or more timing candidates at which the header was correctly read, and a data acquisition section acquires the receive data at the decided data acquisition timing.

Abstract: An electronic device includes a reception unit configured to receive a television broadcast including a television-program broadcast and a commercial-message broadcast transmitted during the television-program broadcast, a determination unit configured to determine to which of the television-program broadcast and the commercial-message broadcast does the received television broadcast correspond, a recording unit configured to record an image of the received television-program broadcast according to the determination, and a display-control unit that can produce the image of the received television broadcast and that performs control so that at least a single part of the recorded image is produced on the basis of the determination during reception of the commercial-message broadcast on the basis of the determination.

Abstract: A communication apparatus for interfacing various types of signals with different bit-rates is provided. The communication apparatus includes a receiving part receiving input signals, generating frames of a predetermined common format containing control information of the input signals and determining whether the frames are valid and a control part receiving the frames from the receiving part and performing a predetermined internal process based on the result of the determination.

Abstract: A secondary storage device using a nonvolatile semiconductor memory in which individual block areas constituting the nonvolatile semiconductor memory can be used up to their limit of use. When the number of repetitions of erasure in a second block area has reached a predetermined reference value, a searching unit searches active block areas for an alternate block area. A second writing unit writes information which has been stored in the alternate block area, into the second block area. A second correspondence modifying unit associates the physical block number with the logical block number and causes a logical-physical correspondence storing unit to store the correspondence of the thus-associated block numbers. A second erasing unit erases the information stored in the alternate block area and treats the block area with the physical block number as a spare block area.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

Abstract: An apparatus for controlling synchronization in a system having at least first and second units each having internal circuits includes signal paths through which a control signal output from a second unit is sent to a first unit and a control signal output from the first unit is sent to the second unit. A first preparatory process part carries out a process to place the internal circuits of the second unit in an operating state when the second unit is connected to the system and for outputting a control signal to the signal paths. A first function mask control part is provided for stopping the operation of the internal circuits of the second unit when a control signal from the first unit is not received by the second unit, and for restarting the operation of the internal circuits when the control signal is received.