Patents by Inventor Hiroaki Yamana

Hiroaki Yamana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210278293
    Abstract: A sensor includes a base material, a first elastic layer provided on the base material, and a sensor body which is provided on the first elastic layer and includes an electrostatic capacitive sensing part, and the base material and the first elastic layer are bonded such that an area corresponding to the sensing part becomes a non-bonded area.
    Type: Application
    Filed: June 28, 2019
    Publication date: September 9, 2021
    Inventors: Keisuke KINOKUNI, Makoto YAMAGUCHI, Hiroaki YAMANA, Masakazu KOBAYASHI, Ryo SHIRAIWA
  • Patent number: 11009986
    Abstract: An electronic device includes: a housing; a sensor provided on an inner surface of the housing and configured to detect deformation of the housing; and a control unit configured to control an operation of the electronic device on the basis of a detection result of the sensor. The sensor has a first sensing unit configured to detect a prescribed user operation and a second sensing unit configured to compensate for a malfunction.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: May 18, 2021
    Assignee: Sony Corporation
    Inventors: Tomoki Kawabata, Yasushi Itoshiro, Toshiaki Nishikawa, Munetake Ebihara, Akira Fujisawa, Kei Tsukamoto, Hiroaki Yamana, Makoto Yamaguchi, Keisuke Kinokuni
  • Publication number: 20200159359
    Abstract: An electronic device includes: a housing; a sensor provided on an inner surface of the housing and configured to detect deformation of the housing; and a control unit configured to control an operation of the electronic device on the basis of a detection result of the sensor. The sensor has a first sensing unit configured to detect a prescribed user operation and a second sensing unit configured to compensate for a malfunction.
    Type: Application
    Filed: July 20, 2018
    Publication date: May 21, 2020
    Inventors: Tomoki KAWABATA, Yasushi ITOSHIRO, Toshiaki NISHIKAWA, Munetake EBIHARA, Akira FUJISAWA, Kei TSUKAMOTO, Hiroaki YAMANA, Makoto YAMAGUCHI, Keisuke KINOKUNI
  • Patent number: 9354164
    Abstract: There is provided an optical system, including: an extracting section, the refractive index of the extracting section being approximately the same as the refractive index of an observed object, the extracting section being optically coupled with the observed object to thereby extract a terahertz electromagnetic wave generated from the observed object; and an ellipsoidal reflector surface having a first focal point and a second focal point, the observed object being to be arranged on the first focal point, a photoconductive device being on the second focal point, the photoconductive device being configured to detect the terahertz electromagnetic wave extracted by the extracting section, the ellipsoidal reflector surface guiding the extracted terahertz electromagnetic wave to the photoconductive device.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: May 31, 2016
    Assignee: SONY CORPORATION
    Inventors: Hiroaki Yamana, Masanao Kamata
  • Publication number: 20140332687
    Abstract: There is provided an optical system, including: an extracting section, the refractive index of the extracting section being approximately the same as the refractive index of an observed object, the extracting section being optically coupled with the observed object to thereby extract a terahertz electromagnetic wave generated from the observed object; and an ellipsoidal reflector surface having a first focal point and a second focal point, the observed object being to be arranged on the first focal point, a photoconductive device being on the second focal point, the photoconductive device being configured to detect the terahertz electromagnetic wave extracted by the extracting section, the ellipsoidal reflector surface guiding the extracted terahertz electromagnetic wave to the photoconductive device.
    Type: Application
    Filed: May 2, 2014
    Publication date: November 13, 2014
    Applicant: Sony Corporation
    Inventors: Hiroaki Yamana, Masanao Kamata
  • Publication number: 20120056181
    Abstract: There is provided a method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate. The method includes a wiring layer formation step of forming the wiring layer on the substrate; an organic insulating layer formation step of forming an organic insulating layer on the wiring layer; and an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 8, 2012
    Applicant: SONY CORPORATION
    Inventors: Masanao Kamata, Hiroaki Yamana, Iwao Yagi, Noriyuki Kawashima
  • Publication number: 20060067376
    Abstract: The emissivity measuring device 10 of the present invention includes an integrating sphere 18 having an energy entering hole 12 through which radiation energy is made to enter from an infrared ray source 11, a sample hole 14 placed being opposite to an entering direction of radiation energy supplied from the energy entering hole 12 and open edge portions of which are put into contact, in a struck manner, with an object 13 to be tested, and a detecting hole 16 to which a detector 15 to detect radiation energy is attached, wherein the detector 15 detects radiation energy emitted from the object 13 to be tested being multiple-scattered by the integrating sphere 17 via the detecting hole 16 and the detected radiation energy is compared with a measured value of emissivity of a known sample in a calculation controlling means 18 to calculate emissivity of the object 13 to be tested. The temperature sensor is attached to aperture edge portions of the sample hole 14.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 30, 2006
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Shozo Katsuki, Akira Ohnishi, Sumitaka Tachikawa, Hosei Nagano, Hiroaki Yamana