Patents by Inventor Hiroaki YATSUKAWA

Hiroaki YATSUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof
    Patent number: 8680657
    Abstract: In a lead frame for a semiconductor apparatus 10, including plural terminals 13, one portions of the terminals 13 being sealed with a resin, a resin-sealed portion 16 of the terminal 13 has a polygonal columnar shape that is pentagonal or more or a deformed columnar shape having at least one notch or groove part extending vertically in a periphery. This resin-sealed portion 16 is formed by etching processing or press processing, and an exposed portion 18 of lower half of the terminal 13 is formed by the etching processing.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: March 25, 2014
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Koji Shimizu, Hiroaki Yatsukawa
  • LEAD FRAME, SEMICONDUCTOR APPARATUS USING THIS LEAD FRAME, INTERMEDIATE PRODUCT THEREOF AND MANUFACTURING METHOD THEREOF
    Publication number: 20110272793
    Abstract: In a lead frame for a semiconductor apparatus 10, including plural terminals 13, one portions of the terminals 13 being sealed with a resin, a resin-sealed portion 16 of the terminal 13 has a polygonal columnar shape that is pentagonal or more or a deformed columnar shape having at least one notch or groove part extending vertically in a periphery. This resin-sealed portion 16 is formed by etching processing or press processing, and an exposed portion 18 of lower half of the terminal 13 is formed by the etching processing.
    Type: Application
    Filed: November 24, 2009
    Publication date: November 10, 2011
    Applicant: MITSUI HIGH-TEC, INC.,
    Inventors: Koji SHIMIZU, Hiroaki YATSUKAWA