Abstract: A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

Abstract: [Object] To provide a laser processing apparatus and a laser processing method which are capable of reducing roughness of a cut surface in laser cutting using laser beams transmitted through optical fibers. [Solution] A laser processing apparatus according to the present invention includes at least one laser oscillator configured to emit laser beams, a plurality of optical fibers configured to transmit the emitted laser beams, and at least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate a surface of a workpiece with the focused laser beams. At output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes.

Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

Abstract: A laser processing apparatus includes a laser irradiation unit has a structure providing an intensity distribution of the laser beam focused on the grain-oriented electrical steel sheet on a cross-section in a direction perpendicular to the scanning direction on the grain-oriented electrical steel sheet so as to satisfy Ib/Ia?2, where Ra1 and Ra2 are distances between the centroid of the intensity distribution and positions at which the intensity integration value from the centroid of the intensity distribution is 43% of the total intensity integration value, beam intensities Ia1 and Ia2 are intensities of the laser beam corresponding to Ra1 and Ra2, respectively, Ia is the average value of Ia1 and Ia2 and Ib is the beam intensity at the centroid of the intensity distribution.

Abstract: A laser apparatus of the present invention has a first laser oscillator that emits a first laser beam; a passive fiber that is a double-clad fiber that transmits the first laser beam through a core; and a second laser oscillator that emits a second laser beam that is coupled into inner cladding of the passive fiber. Additionally, a laser materials processing apparatus of the present invention is provided with the laser apparatus; and an irradiation optical system having a collimating lens and a condenser lens.

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

Abstract: An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.

Abstract: A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Abstract: A processed substrate and a method for easily manufacturing the processed substrate with high efficiency are provided, the processed substrate having openings in respective surfaces thereof that are matched to each other in size. The processed substrate includes a light transmissive substrate having a plurality of through-holes. Each of the through-holes has a large-diameter opening and a small-diameter opening, the large-diameter opening being larger in size than the small-diameter opening by 5% or less of the size of the large-diameter opening. As such, through-holes with openings in the respective surfaces of the processed substrate that are matched to each other in size can be provided.

Abstract: Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.

Abstract: A grain-oriented magnetic steel sheet includes grooves each of which extends in a direction intersecting a transportation direction, the grooves being formed at predetermined pitches PL in the transportation direction by laser beam irradiation, in which a relationship between a standard deviation value D and the pitch PL satisfies the following expression (1), the standard deviation value D being a standard deviation of distances between a linear approximation line, which is obtained from a center line of each of the grooves in a groove width direction by a least-squares method, and respective positions on the center line, and an average angle formed between tangent lines of the respective positions on the center line and a direction perpendicular to the transportation direction is more than 0° to 30°. [Expression 1] 0.

Abstract: An adhesive composition including a block copolymer. An adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G?) of 1.5×105 Pa or less at 220° C., and a loss factor (tan ?) of 1.3 or less at 220° C.

Abstract: An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

Abstract: An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

Abstract: An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.

Abstract: A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member.

Abstract: An adhesive composition for bonding a wafer and a support for the wafer. The adhesive composition contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight of the styrene unit is 10,000 to 200,000.

Abstract: An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

Abstract: The present invention provides a method of producing a common rail having a common rail body and a holder which include chemical components of 0.01-0.3 mass % of C, 0.01-0.5 mass % of Si, 0.01-3.0 mass % of Mn, 0.0003-0.01 mass % of B, 0.001-0.01 mass % of N, over 0.01-0.5 mass % of Al, 0.01-0.05 mass % of Ti, P limited to 0.03 mass % or less, S limited to 0.01 mass % or less, O limited to 0.01 mass % or less, a total content of As, Sn, Sb, Pb, and Zn limited to 0.015 mass % or less, the balance including Fe and inevitable impurities, in which the TLB value is 0.001% or more, the method including: inserting an insert metal; performing liquid phase diffusion bonding; performing laser-peening; and removing a surface layer.