Patents by Inventor Hirofumi Ishibashi

Hirofumi Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230223587
    Abstract: There is provided a solid electrolyte production method which can provide a solid electrolyte having a high ion conductivity at low cost with high productivity using a liquid-phase method. The method comprises drying a slurry by fluidized drying using media particles as a medium. The slurry includes a solid electrolyte comprising at least an alkali metal, sulfur atoms and phosphorus atoms as constituent atoms, or a precursor of the solid electrolyte, and a polar solvent.
    Type: Application
    Filed: May 10, 2021
    Publication date: July 13, 2023
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Shogo SHIMADA, Hirofumi ISHIBASHI, Yasuhito KAGOTA
  • Patent number: 9565760
    Abstract: In a wiring board, on an insulating layer of an outermost layer, there are provided a plurality of strip-shaped wiring conductors which are partially provided with semiconductor element connection pads to which electrode terminals of a semiconductor element are connected, at positions which prevent the semiconductor element connection pads adjacent to each other from being laterally arranged, and a solder resist layer having openings for individually exposing the semiconductor element connection pads is adhered on the insulating board as the outermost layer and on the strip-shaped wiring conductors, wherein the solder resist layer internally contains an insulating filler, and the insulating filler is sunk below the upper surfaces of the strip-shaped wiring conductors.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: February 7, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Hirofumi Ishibashi, Masanori Tada
  • Publication number: 20150000968
    Abstract: In a wiring board, on an insulating layer of an outermost layer, there are provided a plurality of strip-shaped wiring conductors which are partially provided with semiconductor element connection pads to which electrode terminals of a semiconductor element are connected, at positions which prevent the semiconductor element connection pads adjacent to each other from being laterally arranged, and a solder resist layer having openings for individually exposing the semiconductor element connection pads is adhered on the insulating board as the outermost layer and on the strip-shaped wiring conductors, wherein the solder resist layer internally contains an insulating filler, and the insulating filler is sunk below the upper surfaces of the strip-shaped wiring conductors.
    Type: Application
    Filed: June 23, 2014
    Publication date: January 1, 2015
    Applicant: KYOCERA SLC Technologies Corporation
    Inventors: Hirofumi ISHIBASHI, Masanori TADA
  • Patent number: 6605242
    Abstract: The invention provides a method of producing styrenic resin granulates including dry-compression-molding a powder of styrenic resin having a syndiotactic configuration at a compression pressure of 1-20 t/cm and at a molding temperature falling within the range of the glass transition temperature of the powder of styrenic resin to the melting point thereof, inclusive; and crushing the resultant molded product. High-quality styrenic polymer granulates can be produced in an industrially advantageous manner by means of a large-scale apparatus for producing styrenic polymer having a syndiotactic configuration.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: August 12, 2003
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventor: Hirofumi Ishibashi
  • Publication number: 20020125602
    Abstract: The invention provides a method of producing styrenic resin granulates including dry-compression-molding a powder of styrenic resin having a syndiotactic configuration at a compression pressure of 1-20 t/cm and at a molding temperature falling within the range of the glass transition temperature of the powder of styrenic resin to the melting point thereof, inclusive; and crushing the resultant molded product. High-quality styrenic polymer granulates can be produced in an industrially advantageous manner by means of a large-scale apparatus for producing styrenic polymer having a syndiotactic configuration.
    Type: Application
    Filed: October 30, 2001
    Publication date: September 12, 2002
    Applicant: IDEMITSU PETROCHEMICAL CO., LTD.
    Inventor: Hirofumi Ishibashi
  • Patent number: 6110406
    Abstract: Disclosed is a method for producing a molding material, which comprises melt-extruding a styrenic polymer essentially having a syndiotactic structure or a composition containing the polymer to give strands, then rapidly cooling the resulting strands to thereby make the surface temperature of the strands not higher than the melting point of the styrenic polymer or the composition containing the polymer, and thereafter gradually cooling them to thereby make the surface temperature of the strands not higher than a temperature higher by 20.degree. C. than their glass transition temperature, and finally pelletizing the strands into pellets. The pellets produced have a high degree of crystallinity and can be well molded into good moldings.
    Type: Grant
    Filed: December 24, 1997
    Date of Patent: August 29, 2000
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Hirofumi Ishibashi, Kenzi Hirose