Abstract: According to one embodiment, a control system controls a robot. The control system includes a first system and a second system. The first system transmits a first command and supplementary data. The first command is represented using a specification different from a control command specification used by a controller of the robot. The supplementary data corresponds to the first command. The second system generates a second command based on the first command, attaches the supplementary data to the second command, and transmits the second command to the controller. The second command corresponds to the control command specification.

Abstract: According to one embodiment, a semiconductor device includes first and second electrodes, first to third semiconductor regions, first and second conductive parts, first and second gate electrodes, and a first connection part. The first semiconductor region is located on the first electrode. The second semiconductor region is located on the first semiconductor region. The third semiconductor region is located on a portion of the second semiconductor region. The first conductive part is located in the first semiconductor region with a first insulating part interposed. The first gate electrode is located in the first insulating part. The second conductive part is located in the first semiconductor region with a second insulating part interposed. The second gate electrode is located in the second insulating part. The first connection part is located higher than the second and third semiconductor regions. The second electrode is located on the second and third semiconductor regions.

Abstract: According to one embodiment, a control system controls a robot. The control system includes a first system and a second system. The first system transmits a first command and supplementary data. The first command is represented using a specification different from a control command specification used by a controller of the robot. The supplementary data corresponds to the first command. The second system generates a second command based on the first command, attaches the supplementary data to the second command, and transmits the second command to the controller. The second command corresponds to the control command specification.

Abstract: According to one embodiment, a picking system includes a picking robot and a control device. The picking robot transfers an object from a first space to a second space by using a robot hand. The control device controls the picking robot. When a first measurement result related to a shape of the object in the first space when viewed along a first direction is acquired, the control device performs a first calculation of calculating a position candidate for placing the object in the second space based on the first measurement result. When a second measurement result related to a shape of the object when viewed along a second direction is acquired, the control device performs a second calculation of calculating a position of the robot hand when placing the object in the second space based on the second measurement result and the position candidate.

Abstract: A semiconductor device includes a semiconductor substrate having a source region and a drain region, a first insulator between the source region and the drain region, a gate electrode having a first end on a side thereof closer to the source region than the drain region on a portion of the semiconductor substrate that is not covered with the first insulator, and having a second end on the first insulator closer to the drain region than the source region, and a second insulator that is continuous with the second end of the gate electrode and having a portion which is on the first insulator where the first insulator is not covered with the gate electrode, is on an end of the drain region, and is in contact with the gate electrode, the first insulator, and the drain region.

Abstract: According to one embodiment, a control system controls a robot. The control system includes a first system and a second system. The first system transmits a first command and supplementary data. The first command is represented using a specification different from a control command specification used by a controller of the robot. The supplementary data corresponds to the first command. The second system generates a second command based on the first command, attaches the supplementary data to the second command, and transmits the second command to the controller. The second command corresponds to the control command specification.

Abstract: A semiconductor device includes a semiconductor substrate having a source region and a drain region, a first insulator between the source region and the drain region, a gate electrode having a first end on a side thereof closer to the source region than the drain region on a portion of the semiconductor substrate that is not covered with the first insulator, and having a second end on the first insulator closer to the drain region than the source region, and a second insulator that is continuous with the second end of the gate electrode and having a portion which is on the first insulator where the first insulator is not covered with the gate electrode, is on an end of the drain region, and is in contact with the gate electrode, the first insulator, and the drain region.

Abstract: A semiconductor device includes a first semiconductor layer of a first conductivity type, a first element including a second semiconductor layer of a second conductivity type, a second element including a third semiconductor layer of the second conductivity type, a first conductive member disposed in the first semiconductor layer between the first element and the second element, and a first semiconductor region of the second conductivity type provided inside the first semiconductor layer and contacting the first conductive member. A portion of the first element and a portion of the second element are formed in an upper layer portion of the first semiconductor layer. An upper end of the first conductive member is positioned higher than an upper end of the second semiconductor layer. A lower end of the first conductive member is positioned lower than lower ends of the second and third semiconductor layers.

Abstract: A steam release standing pouch has a structure in which the sealing portion is reliably peeled, and a content sealing standing pouch formed using the pouch. The steam release standing pouch has a first vapor passage portion. The distance between the inner edge of the tip of the vapor passage portion and the center of maximum expansion, which is the center of the portion where expansion is expected to be maximal, is shorter than either the distance between the inner edge of the first upper side portion and the center of maximum expansion or the distance between the inner edge of the first intermediate side portion and the center of maximum expansion.

Abstract: Provided are a steam release standing pouch, which has a structure in which the sealing portion is reliably peeled, and a content sealing standing pouch formed using the pouch. The steam release standing pouch has a first vapor passage portion. The distance between the inner edge of the tip of the vapor passage portion and the center of maximum expansion, which is the center of the portion where expansion is expected to be maximal, is shorter than either the distance between the inner edge of the first upper side portion and the center of maximum expansion or the distance between the inner edge of the first intermediate side portion and the center of maximum expansion.

Abstract: A steam release standing pouch has a structure in which the sealing portion is reliably peeled, and a content sealing standing pouch formed using the pouch. The steam release standing pouch has a first vapor passage portion. The distance between the inner edge of the tip of the vapor passage portion and the center of maximum expansion, which is the center of the portion where expansion is expected to be maximal, is shorter than either the distance between the inner edge of the first upper side portion and the center of maximum expansion or the distance between the inner edge of the first intermediate side portion and the center of maximum expansion.

Abstract: Provided are a steam release standing pouch, which has a structure in which the sealing portion is reliably peeled, and a content sealing standing pouch formed using the pouch. The steam release standing pouch has a first vapor passage portion. The distance between the inner edge of the tip of the vapor passage portion and the center of maximum expansion, which is the center of the portion where expansion is expected to be maximal, is shorter than either the distance between the inner edge of the first upper side portion and the center of maximum expansion or the distance between the inner edge of the first intermediate side portion and the center of maximum expansion.

Abstract: A packaging bag having a steam venting function capable of releasing pressure inside a package even when heating cooking is performed by a microwave oven and preventing the inside of the bag from being contaminated and the package using the packaging bag. The packaging bag includes two pieces of front and back main body films having sealant layers which are opposed to each other with the sealant layers facing inward, side seal parts, and a bottom seal part. The front body film is folded in the vicinity of the bottom seal part throughout the entire width of the bag and parallel with the bottom seal part to form a fold-in part. A steam venting port is formed in the fold-in part, and an easily peelable tape covering the steam venting port is disposed on the inside of the fold-in part throughout the width of the bag and parallel with the fold-in part, and then heat-sealed.

Abstract: A packaging bag having a steam venting function capable of releasing pressure inside a package even when heating cooking is performed by a microwave oven and preventing the inside of the bag from being contaminated and the package using the packaging bag. The packaging bag 1 comprises two pieces of front and back main body films 2 and 3 having sealant layers 2s and 3s which are opposed to each other with the sealant layers facing inward, side seal parts 5, and a bottom seal part 4. The front body film 2 is folded in the vicinity of the bottom seal part 4 throughout the entire width of the bag and parallel with the bottom seal part to form a fold-in part 8. A steam venting port 11 is formed in the fold-in part 8, and an easily peelable tape 12 covering the steam venting port 11 is disposed on the inside of the fold-in part 8 throughout the width of the bag and parallel with the fold-in part8, and then heat-sealed.

Abstract: A lid member for a food container having a layered structure in which a surface sheet is laid on a composite sheet, said surface sheet including an easily-peelable area that is easily separated from the composite sheet, formed by applying a lubricant between the surface sheet and the composite sheet, said surface sheet including a non-peelable area adjacent to said easily-peelable area; a first slit cut vertical-sectionally through the composite sheet, said first slit defining one or more apertures in said lid to form an opening area in said composite sheet; a second slit in said surface sheet defining a boundary between the easily-peelable area and said non-peelable area of said surface sheet; and said surface sheet being adhered to said composite sheet at said composite sheet opening area over an area that is smaller than said composite sheet opening area.

Abstract: A semiconductor device comprises a collector layer comprising a first kind of semiconductor material; a base layer including a first base portion and a second base portion, said first base portion coming in contact with the first collector layer and comprising the first kind of semiconductor material, said second base portion coming in contact with the first base portion and comprising a second kind of semiconductor material; and an emitter layer coming in contact with the base layer and comprising the first kind of semiconductor material, said emitter layer forming a heterojunction with the base layer.

Abstract: A lid member for a food container comprising an easily-peelable area of the layered structure having a lubricant between the base layer and the surface sheet, a non-peelable opening area of the layered structure disposed within the easily-peelable area; a non-peelable area of the layered structure disposed adjacent to easily-peelable area, said lid member further comprising a first tab to peel off the lid member from the container body, a second tab formed on the easily-peelable area along the boundary line between the non-peelable area and the easily-peelable area to open the apertures of the opening area, a first slit, cut from the base layer to the adhesive layer forming apertures in the opening area, a second slit, cut from the surface sheet to the adhesive layer, along the boundary line between the easily-peelable area and non-peelable area, and a third slit, cut from the base layer to the adhesive layer and disposed where the second tab is mounted, from a foot-end of the second tab, spaced from the seco

Abstract: The opening width of an element isolating trench is Wa'. The opening width of a substrate potential setting trench is Wb'. When the maximum film thickness of a polysilicon film lying on the side wall of each of the trenches is set to t, the opening width Wa' of the element isolating trench and the opening width Wb' of the substrate potential setting trench satisfies a condition that (Wa'-2t)<(Wb'-2t) and Wa'>2t. A silicon oxide film covers the entire portion of the internal surface of the element isolating trench and covers the internal surface of the substrate potential setting trench except the bottom portion thereof. Therefore, the polysilicon film in the element isolating trench is set in the electrically floating state and the polysilicon film in the substrate potential setting trench is connected to the semiconductor substrate.