Abstract: The present disclosure provides a medium processing apparatus, including: a housing provided with a surface facing a customer operating the medium processing apparatus; and a rolled coin device housed in the housing and configured to process rolled coins formed by bundling a plurality of loose coins. The surface of the housing includes a designated area located in a height range conforming to Americans with Disabilities Act (ADA) standard with respect to a height direction of the medium processing apparatus, and a rolled coin dispensing port of the rolled coin device for dispensing the rolled coins is arranged in the designated area.

Abstract: A display apparatus includes a display unit, an acquiring unit configured to acquire a captured image generated by capturing a displayed image, which is displayed by the display unit, by an image pickup apparatus, and a control unit configured to cause the display unit to display the captured image together with or instead of the displayed image. The control unit causes the display unit to stop displaying the captured image when the image pickup apparatus captures the displayed image.

Abstract: The present invention provides crystals of (1R,3R,15E,28R,29R,30R,31R,34R,36R,39S,41R)-29,41-Difluoro-34,39-bis(sulfanyl)-2,33,35,38,40,42-hexaoxa-4,6,9,11,13,18,20,22,25,27-decaaza-34?5,39?5-diphosphaoctacyclo[28.6.4.13,36.128,31.04,8.07,12.019,24.023,27]dotetraconta-5,7,9,11,15,19,21,23,25-nonaene-34,39-dione (Compound (I)) ammonium salts, Compound (I) sodium salts, or Compound (I), possessing a potential to be used as drug substance in pharmaceuticals.

Abstract: A display apparatus includes a display unit, an acquiring unit configured to acquire a captured image generated by capturing a displayed image, which is displayed by the display unit, by an image pickup apparatus, and a control unit configured to cause the display unit to display the captured image together with or instead of the displayed image. The control unit causes the display unit to stop displaying the captured image when the image pickup apparatus captures the displayed image.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: The present invention provides crystals of (1R,3R,15E,28R,29R,30R,31R,34R,36R,39S,41R)-29,41-Difluoro-34,39-bis(sulfanyl)-2,33,35,38, 40,42-hexaoxa-4,6,9,11,13,18,20,22,25,27-decaaza-34?5,39?5-diphosphaoctacyclo[28.6.4.13,36.128,31.04,8.07,12.019,24.023,27]dotetraconta-5,7,9,11,15,19,21,23,25-nonaene-34,39-dione (Compound (I)) ammonium salts, Compound (I) sodium salts, or Compound (I), possessing a potential to be used as drug substance in pharmaceuticals.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: A resin composition for sealing of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by Formula (1). In Formula (1), R1 represents a polar group or a hydrocarbon group. An electronic component device (10) of the present invention has an electronic component (11) and a sealing material (12) sealing the electronic component (11), in which the sealing material (12) is a cured substance of the resin composition for sealing.

Abstract: Provided is a compound represented by formula (IV) or a salt thereof, wherein the content of the compound represented by formula (I) is 350 ppm by mass or less.

Abstract: The present invention provides an early-maturing transgenic plant, which comprises a nucleic acid that encodes a protein having activity of causing early maturation of a plant, so that the gene can be expressed.

Abstract: The present invention relates to a fruit-specific promoter, which is suitable for the expression in a broader range of developmental stages of a fruit. Provided is a fruit-specific promoter DNA, which consists of a nucleotide sequence having 85% or more identity with the nucleotide sequence as shown in SEQ ID NO: 1 or 2 and has promoter activity in mature-green fruits.

Abstract: A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0.

Abstract: A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).

Abstract: A press-molding device (80) press molds a bottom portion of a work piece (9) having a closed-end shape between an, inner die (521) inserted into the work piece (9) and an outer die (551) disposed on an outside of the work piece (9). A chuck position switching mechanism (501) grips the work piece (9) so that the work piece (9) can move in an axial direction. An inner die moving mechanism (522) inserts the inner die (521) into the inside end of the work piece (9). A stopper mechanism (531) supports the inner die (521) in a processing position by restricting movement of the inner die (521). An outer die moving mechanism (552) press-molds the bottom portion of the work piece (9) between the outer die (551) and the inner die (521), thereby press-molding the workpiece (9) smoothly without damaging an inner peripheral surface of the workpiece (9).