Abstract: A timepiece component decoration method includes a base formation step of forming a pattern shape on a base material of a timepiece component and using the pattern shape as a base, a first light-transmissive layer formation step of forming, on a surface of the base, a first light-transmissive layer using a light-transmissive resin, a first liquid repellent treatment step of performing a liquid repellent treatment on a surface of the first light-transmissive layer, and a first printed layer formation step of, to form a first printed layer, ejecting ink and printing a pattern shape by an inkjet method on the surface of the first light-transmissive layer on which the liquid repellent treatment was performed, after the first liquid repellent treatment step.

Abstract: A dial decoration method of the present disclosure is a dial decoration method including a base formation step of forming a pattern shape on a base material and using the pattern shape as a base, and a printed layer formation step of forming a printed layer on a surface side of the base, and the printed layer formation step includes printing a pattern shape, to form the printed layer, by changing a density of dots of ink ejected by an inkjet method.

Abstract: This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of connection lines, formed by a liquid drop ejection method, each of which electrically connects together one of the plurality of device electrodes and one of the plurality of substrate electrodes. The plurality of substrate electrodes are arranged in a staggered configuration.

Abstract: An electrophoresis display includes an element substrate; a counter substrate; an electrophoresis layer sandwiched between the element substrate and the counter substrate; and a driver circuit disposed in an area of the element substrate that is outside a display area. In this electrophoresis display, the counter substrate overlaps the display area and at least part of an area of the element substrate where the driver circuit is disposed.

Abstract: An electrophoresis display includes an element substrate; a counter substrate; an electrophoresis layer sandwiched between the element substrate and the counter substrate; and a driver circuit disposed in an area of the element substrate that is outside a display area. In this electrophoresis display, the counter substrate overlaps the display area and at least part of an area of the element substrate where the driver circuit is disposed.

Abstract: A contactless data communication system includes a reader-writer device, a contactless identification tag including a plurality of contactless identification tags, and baggage including multiple pieces of baggage. The reader-writer device includes a data reception part, a data transmission part, a control part, an operation part, and a display part. The contactless identification tag includes a data communication part, a data control part, a voltage monitoring part, a detachment detection part, a display processing part, and an electrophoresis display device. The voltage monitoring part and the detachment detection part detect a voltage change caused when the contactless identification tag is detached from the baggage, so as to detect that the contactless identification tag is detached.

Abstract: An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the active surface of the electronic element is formed at the periphery of the electronic element (slope forming step). Metallic wiring for connecting electrode terminals on the active surface to wiring patterns on the wiring board is formed on the surface of the slope by a droplet ejection method (metallic wiring forming step). In the invention, prior to forming the metallic wiring, an organic insulating membrane formed of epoxy resin or urethane resin is formed on the active surface of the electronic element, on which the corresponding metallic wiring is formed (insulative ink processing step), thereby improving adhesivity.

Abstract: A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for conducting between the wiring pattern 17 and the wiring pattern 31, wherein the polyimide 22 is disposed around the interlayer conducting post 18 using a liquid drop discharge system.

Abstract: An adhesive tape constructed of a base material 11 and an adhesive layer 12 is used as a substrate 1. Droplets 2 formed of a liquid containing electrically conductive ultra-fine particles dispersed therein are disposed in a specified wiring pattern on the adhesive layer 12. The adhesive tape 1 is put into a hot-air oven 3 to dry the disperse medium from the droplets 2. Accordingly, a wiring layer 21 made of silver particles contained in the droplets 2 is formed on the adhesive layer 12 of the adhesive tape 1.

Abstract: A receiving layer formed of a thermoplastic resin is softened by applying heat. By using a solvent containing conductive particles, an interconnect layer is formed on the receiving layer which is softened by the application of heat. The conductive particles are bonded together by heating the interconnect layer.

Abstract: A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the thermosetting resin precursor and to bond the conductive particles together.

Abstract: A contactless data communication system includes a reader-writer device, a contactless identification tag including a plurality of contactless identification tags, and baggage including multiple pieces of baggage. The reader-writer device includes a data reception part, a data transmission part, a control part, an operation part, and a display part. The contactless identification tag includes a data communication part, a data control part, a voltage monitoring part, a detachment detection part, a display processing part, and an electrophoresis display device. The voltage monitoring part and the detachment detection part detect a voltage change caused when the contactless identification tag is detached from the baggage, so as to detect that the contactless identification tag is detached.

Abstract: A contactless data communication system includes a reader-writer device, a contactless identification tag including a plurality of contactless identification tags, and baggage including multiple pieces of baggage. The reader-writer device includes a data reception part, a data transmission part, a control part, an operation part, and a display part. The contactless identification tag includes a data communication part, a data control part, a voltage monitoring part, a detachment detection part, a display processing part, and an electrophoresis display device. The voltage monitoring part and the detachment detection part detect a voltage change caused when the contactless identification tag is detached from the baggage, so as to detect that the contactless identification tag is detached.

Abstract: An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the active surface of the electronic element is formed at the periphery of the electronic element (slope forming step). Metallic wiring for connecting electrode terminals on the active surface to wiring patterns on the wiring board is formed on the surface of the slope by a droplet ejection method (metallic wiring forming step). In the invention, prior to forming the metallic wiring, an organic insulating membrane formed of epoxy resin or urethane resin is formed on the active surface of the electronic element, on which the corresponding metallic wiring is formed (insulative ink processing step), thereby improving adhesivity.

Abstract: This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of connection lines, formed by a liquid drop ejection method, each of which electrically connects together one of the plurality of device electrodes and one of the plurality of substrate electrodes. The plurality of substrate electrodes are arranged in a staggered configuration.

Abstract: An adhesive tape constructed of a base material 11 and an adhesive layer 12 is used as a substrate 1. Droplets 2 formed of a liquid containing electrically conductive ultra-fine particles dispersed therein are disposed in a specified wiring pattern on the adhesive layer 12. The adhesive tape 1 is put into a hot-air oven 3 to dry the disperse medium from the droplets 2. Accordingly, a wiring layer 21 made of silver particles contained in the droplets 2 is formed on the adhesive layer 12 of the adhesive tape 1.

Abstract: A receiving layer formed of a thermoplastic resin is softened by applying heat. By using a solvent containing conductive particles, an interconnect layer is formed on the receiving layer which is softened by the application of heat. The conductive particles are bonded together by heating the interconnect layer.

Abstract: A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the thermosetting resin precursor and to bond the conductive particles together.

Abstract: A contactless data communication system includes a reader-writer device, a contactless identification tag including a plurality of contactless identification tags, and baggage including multiple pieces of baggage. The reader-writer device includes a data reception part, a data transmission part, a control part, an operation part, and a display part. The contactless identification tag includes a data communication part, a data control part, a voltage monitoring part, a detachment detection part, a display processing part, and an electrophoresis display device. The voltage monitoring part and the detachment detection part detect a voltage change caused when the contactless identification tag is detached from the baggage, so as to detect that the contactless identification tag is detached.

Abstract: A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for conducting between the wiring pattern 17 and the wiring pattern 31, wherein the polyimide 22 is disposed around the interlayer conducting post 18 using a liquid drop discharge system.