Abstract: A semiconductor wafer and a substrate are positioned facing each other, and electrode pads of individual semiconductor chips and connecting electrode pads of package bases are bonded simultaneously. The semiconductor wafer and the substrate are cut at the same time and divided into semiconductor chips. After expanding spaces between the divided semiconductor chips a predetermined width in an expanding process, a sealing resin is applied so that the large number of semiconductor chips and package bases are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces. Thus, semiconductors devices sealed with a resin are formed.

Abstract: A semiconductor wafer and a substrate are positioned facing each other, and electrode pads of individual semiconductor chips and connecting electrode pads of package bases are bonded simultaneously. The semiconductor wafer and the substrate are cut at the same time and divided into semiconductor chips. After expanding spaces between the divided semiconductor chips a predetermined width in an expanding process, a sealing resin is applied so that the large number of semiconductor chips and package bases are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces. Thus, semiconductor devices sealed with a resin are formed.

Abstract: A semiconductor wafer 6 and a substrate 7 are faced each other, and electrode pads (not shown) of individual semiconductor chips 2 and connecting electrode pads of package bases 3 are bonded at once, and then the semiconductor wafer 6 and the substrate 7 are cut at the same time and divided into semiconductor chips 2. After expanding spaces between the divided semiconductor chips 2 (package bases 3) to a predetermined width by an expanding process, a sealing resin is applied so that the large number of semiconductor chips 2 and package bases 3 are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces, thus a semiconductor device sealed with a resin is formed.

Abstract: A thermosetting epoxy adhesive 9 is applied at the end portion of one surface of the radiating plate 8 onto which a protection ring is bonded, and a protection tape 13 provided with projections 13a is pasted with the thermosetting epoxy adhesive 9 so that projections 13a may project to the opposite side of the radiating plate 8, to constitute the radiating plate structure 20 as one piece. And the radiating plate structures 20 are stacked within the magazine of the radiating plate mounting machine, each radiating plate structure 20 being picked up by the radiating plate mounting machine, its protection tape being peeled, the radiating plate 8 being mounted at a predetermined position.