Abstract: So as to form pin-form wires or bumps in wire bonding for, for instance, semiconductor devices, the length of a wire (or the tail length) extending from the lower end of a capillary is set longer than the wire length required for forming the ball that is formed in the next step, then the ball is formed on the tip end of the wire, notches are formed in the wire located between the ball and the capillary by a pair of cutters, the ball is bonded to, for instance, an electrode pad, and then the wire is pulled away from the electrode pad so as to cut the wire from the area where the notches are formed.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a suction force control device. The suction force control device comprises a suction-switching electromagnetic valve, a suction force-adjusting electromagnetic valve, a vacuum source, a compressed air source and a throttle valve so that a semiconductor pellet is held on a positioning stage by a suction force that is weak enough that a positioning claw can move the semiconductor pellet for positioning; and upon completion of the positioning, the semiconductor pellet is held to the positioning stage by a suction force that is stronger than the weak suction force used for positioning.

Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.

Abstract: A bump bonding apparatus comprising: a loader section that holds trays which accommodate semiconductor pellets and an unloader section that holds trays which accommodate semiconductor pellets to which bumps have been applied, the loader and unloader sections being provided next to each other on one side of a bonding stage; a buffer station and a supply and holding station provided so as to positionally correspond to the loader section and unloader section, respectively; a first pusher for sending trays from the loader section to the buffer station, a second pusher for sending trays from the supply and holding station to the unloader section, a third pusher for sending trays from the buffer station to the supply and holding station, and a pellet transfer mechanism for picking up a semiconductor pellet in the tray in the supply and holding station, transferring it to the bonding stages and then returning the semiconductor pellets to which bumps have been applied on the bonding stages back to the tray in which t

Abstract: A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.

Abstract: An apparatus for conveying a wafer to wafer work suction-holding stage and then discharging a worked wafer from the wafer work suction-holding stage, including a loader side elevator device, a wafer position correcting stage, a wafer work suction-holding stage, a wafer carrying table and an unloader side elevator device which are successively disposed in this order; and the apparatus further including a conveyor which conveys a wafer inside a loader side magazine carried on the loader side elevator device to a point above the positional correction suction-holding stage, a stopper which positions the wafer conveyed by the conveyor to the wafer position correcting stage, and a feeding pawl moving device which operates after the wafer position correcting stage and wafer work suction-holding stage have been moved vertically so that the upper surface of the wafer position correcting stage is at substantially the same height as the upper surface of the stopper and so that the upper surface of the wafer work suction