Patents by Inventor Hirofumi Ogawa
Hirofumi Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240377993Abstract: A job execution service system includes a cloud side processor that is connected to each of an information processing apparatus and a job execution apparatus, which is installed in a local area as wireless network equipment having a wireless communication function based on a predetermined wireless communication system, via the Internet and that is configured to perform relay of a job sent from the information processing apparatus to the job execution apparatus in a case where a cloud service is provided, in which the cloud side processor selects relay equipment, which relays the job sent from the information processing apparatus that is an execution request source of the job to the job execution apparatus that is an execution destination of the job in response to an instruction from a user, from among the wireless network equipment by referring to communication relationship information indicating a communicable relationship between the wireless network equipment in the local area, provides equipment identificType: ApplicationFiled: November 8, 2023Publication date: November 14, 2024Applicant: FUJIFILM Business Innovation Corp.Inventor: Hirofumi OGAWA
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Publication number: 20240343844Abstract: A polyvinyl ether-based polymer useful as a gellant, having a structural unit represented by formula (2): where R1 represents a linear or branched alkanediyl group having 1 to 5 carbon atoms, R2 represents a single bond or a linear or branched alkanediyl group having 1 to 5 carbon atoms, X represents —C(?O)OH, —C(?O)O-M+, or —C(?O)O?, M+ represents a counter ion, and n is an integer of 0 to 3.Type: ApplicationFiled: October 21, 2022Publication date: October 17, 2024Applicants: UNIVERSITY OF FUKUI, MARUZEN PETROCHEMICAL CO., LTD.Inventors: Shinji SUGIHARA, Hirofumi OGAWA
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Patent number: 12060241Abstract: A sheet conveying device includes a sheet conveying passage and a switching guide. The switching guide switches the sheet conveying passage between first and second sheet conveying passages. The switching guide includes a plurality of guide ribs and guide members. The plurality of guide ribs are disposed at intervals in the sheet width direction and extend in the sheet conveying direction. The guide members are fitted to specific guide ribs selected from the plurality of guide ribs. The plurality of guide ribs have first and second guide surfaces that guide the sheet. The guide members are formed of a material having higher slidability than the plurality of guide ribs, and have third guide surfaces that are disposed at positions protruding further to an inner side of the sheet conveying passage than the first or second guide surfaces.Type: GrantFiled: October 19, 2022Date of Patent: August 13, 2024Assignee: KYOCERA Document Solutions Inc.Inventors: Hirofumi Tsuji, Shikitaro Ogawa
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Publication number: 20240198774Abstract: An automobile weather strip includes an extrusion-molded portion and a die-molded portion. The die-molded portion includes: a mount base to be mounted on the periphery of the door; and a hollow seal integrally molded with the mount base and coming into elastic contact with the circumferential edge of a vehicle body opening. The mount base includes a bottom in the shape of a plate. The bottom has a core removal slit for removing a core, and the core removal slit extends in a longitudinal direction of the die-molded portion. The core removal slit has a length set shorter than the length of the core in the same direction. The bottom includes a thick-walled portion at a portion adjacent to an edge of the core removal slit. The thick-walled portion is thicker than the other portions of the bottom.Type: ApplicationFiled: November 15, 2023Publication date: June 20, 2024Applicant: Nishikawa Rubber Co., Ltd.Inventors: Hirofumi OGAWA, Haruki Sentani
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Patent number: 11546479Abstract: An information processing apparatus includes a processor configured to receive an instruction to execute a service by utterance, and perform control to present execution information regardless of whether or not a setting for presenting the execution information is performed, the execution information being information indicating an execution result of the received service.Type: GrantFiled: July 29, 2020Date of Patent: January 3, 2023Assignee: FUJIFILM Business Innovation Corp.Inventor: Hirofumi Ogawa
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Publication number: 20220399018Abstract: An information processing apparatus includes a processor configured to receive a request for a process based on a spoken voice of a user, and in a case where the request includes a first setting and a second setting that are in a prohibition relationship, perform a control for performing the process with the first setting in a case where the first setting is spoken earlier than the second setting in the spoken voice.Type: ApplicationFiled: November 4, 2021Publication date: December 15, 2022Applicant: FUJIFILM Business Innovation Corp.Inventor: Hirofumi OGAWA
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Patent number: 11220166Abstract: The present invention reduces leakage of water into an automotive vehicle, regardless of an inclination at which the automotive vehicle is parked and/or a volume of water. A sealing member of a sliding door in accordance with the present invention includes: a first inner wall (21); a first curved wall (22); a connection wall (24) connecting between the first inner wall (21) and the first curved wall (22); and a first water-conveying part (8) provided on a vehicle-exterior side surface of the first inner wall (21), the connection wall (24) having a hole (h1) at a position opposed to a front tip of the first water-conveying part (8), the hole (h1) being formed so as to lead to a hollow part (25), the water received by the first water-conveying part (8) flowing into the hollow part (25) through the hole (h1).Type: GrantFiled: January 21, 2020Date of Patent: January 11, 2022Assignee: NISHIKAWA RUBBER CO., LTD.Inventor: Hirofumi Ogawa
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Publication number: 20210266417Abstract: An information processing apparatus includes a processor configured to receive an instruction to execute a service by utterance, and perform control to present execution information regardless of whether or not a setting for presenting the execution information is performed, the execution information being information indicating an execution result of the received service.Type: ApplicationFiled: July 29, 2020Publication date: August 26, 2021Applicant: FUJI XEROX CO., LTD.Inventor: Hirofumi OGAWA
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Patent number: 11084363Abstract: Curling of a connection part of a second sealing member is avoided, the curling occurring in a case where the second sealing member is brought into elastic contact with a first sealing member. An end part of a third inner wall, which end part is located on a connection-part side, is thinner than the other part of the third inner wall, and at least a tip of the connection part is located on a vehicle-interior side of a vehicle-interior-side side surface of the third inner wall. A first curved wall and a second curved wall are brought into contact with each other in a case where a first end part and a second end part are caused to abut each other.Type: GrantFiled: October 18, 2019Date of Patent: August 10, 2021Assignee: NISHIKAWA RUBBER CO., LTD.Inventor: Hirofumi Ogawa
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Publication number: 20210122220Abstract: The present invention reduces leakage of water into an automotive vehicle, regardless of an inclination at which the automotive vehicle is parked and/or a volume of water. A sealing member of a sliding door in accordance with the present invention includes: a first inner wall (21); a first curved wall (22); a connection wall (24) connecting between the first inner wall (21) and the first curved wall (22); and a first water-conveying part (8) provided on a vehicle-exterior side surface of the first inner wall (21), the connection wall (24) having a hole (h1) at a position opposed to a front tip of the first water-conveying part (8), the hole (h1) being formed so as to lead to a hollow part (25), the water received by the first water-conveying part (8) flowing into the hollow part (25) through the hole (h1).Type: ApplicationFiled: January 21, 2020Publication date: April 29, 2021Inventor: Hirofumi OGAWA
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Publication number: 20210114447Abstract: Curling of a connection part of a second sealing member is avoided, the curling occurring in a case where the second sealing member is brought into elastic contact with a first sealing member. An end part of a third inner wall, which end part is located on a connection-part side, is thinner than the other part of the third inner wall, and at least a tip of the connection part is located on a vehicle-interior side of a vehicle-interior-side side surface of the third inner wall. A first curved wall and a second curved wall are brought into contact with each other in a case where a first end part and a second end part are caused to abut each other.Type: ApplicationFiled: October 18, 2019Publication date: April 22, 2021Inventor: Hirofumi OGAWA
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Publication number: 20200301635Abstract: An information processing system includes information and image processing apparatuses. The information processing apparatus includes a receiving unit receiving a print setting, a print job transmitting unit transmitting to the image processing apparatus a print job reflecting the setting, a prohibition determination job transmitting unit transmitting to the image processing apparatus a prohibition determination job reflecting the setting, and a controller performing control such that the print job reflecting the setting is not transmitted if the setting reflected in the prohibition determination job transmitted by the prohibition determination job transmitting unit is determined to be in a non-printable status.Type: ApplicationFiled: August 7, 2019Publication date: September 24, 2020Applicant: FUJI XEROX CO., LTD.Inventor: Hirofumi OGAWA
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Patent number: 10513169Abstract: An installation base member couples to an opening of an automobile body and has a substantially U-shaped cross section. A hollow seal member includes a first base root and a second base root which extend from an outer-cabin side wall of the installation base member. The hollow seal member in cross section protrudes from the first base root outwardly to a first turning point, curves toward a base root of the flange and connects with the second base root. A side of the first base root includes solid (dense) material. An interval between the first and the second base roots includes sponge material. A first border between the solid (dense) material of the side of the first base root and the sponge material is closer to an exterior of the automobile than the first turning point.Type: GrantFiled: September 5, 2017Date of Patent: December 24, 2019Inventor: Hirofumi Ogawa
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Patent number: 10433420Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.Type: GrantFiled: February 19, 2019Date of Patent: October 1, 2019Assignee: LAPIS Semiconductor Co., Ltd.Inventors: Kentaro Toda, Kenji Arai, Manabu Miyazawa, Kenichiro Nagatomo, Toru Ueno, Tsuguto Maruko, Hirofumi Ogawa, Tetsuo Oomori
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Publication number: 20190261507Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.Type: ApplicationFiled: February 19, 2019Publication date: August 22, 2019Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kentaro TODA, Kenji ARAI, Manabu MIYAZAWA, Kenichiro NAGATOMO, Toru UENO, Tsuguto MARUKO, Hirofumi OGAWA, Tetsuo OOMORI
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Patent number: 10375819Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.Type: GrantFiled: February 20, 2018Date of Patent: August 6, 2019Assignee: LAPIS Semiconductor Co., Ltd.Inventors: Kentaro Toda, Kenji Arai, Manabu Miyazawa, Kenichiro Nagatomo, Touru Ueno, Tsuguto Maruko, Hirofumi Ogawa, Tetsuo Oomori
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Patent number: 10365872Abstract: A print instruction apparatus includes an acquiring unit that acquires basis weight class information from multiple image forming apparatuses to be selected, the basis weight class information representing information on basis weight class of recording paper set for each of the multiple image forming apparatuses, and a generating unit that generates a common basis weight classification from the acquired basis weight class information, the common basis weight classification including a basis weight class common to the multiple image forming apparatuses.Type: GrantFiled: April 11, 2017Date of Patent: July 30, 2019Assignee: FUJI XEROX CO., LTD.Inventors: Hirofumi Ogawa, Nobuki Hagiwara, Koichi Naito, Makoto Kondo
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Patent number: 10334124Abstract: An information processing apparatus to which plural image forming apparatuses having different functions are connected and which transfers a print job transmitted from a terminal apparatus of a user to the image forming apparatus usable by the user, includes a generation unit that generates a model group of the image forming apparatus usable by the user, for each user.Type: GrantFiled: July 26, 2017Date of Patent: June 25, 2019Assignee: FUJI XEROX CO., LTD.Inventors: Nobuki Hagiwara, Koichi Naito, Makoto Kondo, Hirofumi Ogawa
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Patent number: 10081232Abstract: First and second fins extending toward a second-closing door are provided at an upper end of a side-edge seal of a first-closing door of a double door of a vehicle. When the first-closing door is closed, the first fin overlaps the body-side seal, and the second fin overlaps an outer surface of the vehicle body outside the body-side seal. When the second-closing door is closed, an inner surface of the second-closing door abuts on the body-side seal and extends along the side-edge seal. A seal portion of the second-closing door abuts on the outer surface of the vehicle body outside the body-side seal and extends along the side-edge seal. The first and second fins are deformed independently from each other.Type: GrantFiled: May 28, 2015Date of Patent: September 25, 2018Assignee: Nishikawa Rubber Co., Ltd.Inventor: Hirofumi Ogawa
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Publication number: 20180242444Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.Type: ApplicationFiled: February 20, 2018Publication date: August 23, 2018Applicant: LAPIS Semiconductor Co., Ltd.Inventors: Kentaro TODA, Kenji ARAI, Manabu MIYAZAWA, Kenichiro NAGATOMO, Touru UENO, Tsuguto MARUKO, Hirofumi OGAWA, Tetsuo OOMORI