Patents by Inventor Hirofumi Oono

Hirofumi Oono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tablet comprising epoxy resin composition
    Patent number: 6933618
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: August 23, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
  • Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
    Patent number: 6852263
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: February 8, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
  • Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
    Publication number: 20050023715
    Abstract: A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.
    Type: Application
    Filed: July 16, 2004
    Publication date: February 3, 2005
    Inventors: Hirofumi Oono, Minoru Yamane, Yasunobu Ina, Shouichi Umeno
  • Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
    Publication number: 20040210008
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Application
    Filed: May 12, 2004
    Publication date: October 21, 2004
    Applicant: Nitto Denko Corporation
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
  • Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
    Publication number: 20040052933
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Application
    Filed: September 16, 2003
    Publication date: March 18, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
  • Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
    Patent number: 6646063
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: November 11, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
  • Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
    Publication number: 20010045671
    Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
    Type: Application
    Filed: March 29, 2001
    Publication date: November 29, 2001
    Inventors: Akihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono