Abstract: A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.

Abstract: The present invention provides a dicing apparatus which machines with rotary blades a groove in, or cuts, a work mounted on a work table, wherein: a dicing tape to whose upper face the work is stuck can be stuck to or detached from the work table; a contact type displacement meter for measuring the upper face of the dicing tape fitted to the work table is provided; and a cutting depth controlling device which controls the depth of cutting by the rotary blades into the work on the basis of the measured position of the upper face of the dicing tape in the vertical direction is further provided.

Abstract: A wafer observation position designating apparatus and a wafer display position designating method for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.

Abstract: Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.

Abstract: Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mechanisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

Abstract: A wafer is gripped by a chuck part provided at a front end of a slide arm, and the slide arm is moved in the first direction from a reference position, from which the workpiece is transferred to a workpiece cutting part, to a cleansing position, where the cut workpiece is cleansed, so that the wafer can be transferred in the first direction. The wafer is gripped by a chuck part provided at a front end of a rotary arm, which is rotatably supported at a base end by the front end of the slide arm. Then, the slide arm is moved in the first direction and the rotary arm is rotated. Thereby, the wafer can be transferred in the second direction, which is perpendicular to the first direction.

Abstract: Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mecha- nisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.