Patents by Inventor Hirofumi Takeguchi

Hirofumi Takeguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190056666
    Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.
    Type: Application
    Filed: September 7, 2018
    Publication date: February 21, 2019
    Inventors: Tomohiro ISEKI, Hirofumi TAKEGUCHI, Yuichi TERASHITA
  • Patent number: 10120286
    Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: November 6, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Tomohiro Iseki, Hirofumi Takeguchi, Yuichi Terashita
  • Patent number: 10022652
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 17, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20180185856
    Abstract: A liquid processing apparatus includes a holding device, a rotation device, and a processing fluid supply device including a nozzle positioned to face a surface of a substrate, a first supply path connected to the nozzle, and a second supply path connected to the nozzle such that the supply device supplies processing liquid to the substrate. The nozzle has a common flow path extending in radial direction from center portion toward peripheral portion of the substrate, and discharge ports connected to the common path and positioned in the radial direction, the first path is connected to the common path and supplies first liquid to the common path, the second path is connected to the common path and supplies second liquid to the common path that is different from the first liquid in temperature and/or concentration, and the first and second paths are communicatively connected each other via the common path.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 5, 2018
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hirofumi TAKEGUCHI, Terufumi WAKIYAMA, Norihiro ITO
  • Patent number: 9952512
    Abstract: A developing method for forming a resist film having a high uniformity of CD distribution. After exposure of a resist film on a substrate surface to form a resist pattern, the method includes sequential steps of: (A) supplying a developer to the rotating substrate; (B) reacting the resist film with the developer; and (C) removing the developer from the surface of the resist film to terminate the reaction of the resist film with the developer. In step (A), a liquid-contact nozzle, having an ejection orifice for the developer and a lower surface extending laterally from the ejection orifice and disposed opposite the resist film, is used. In step (C), the boundary between a reaction-terminated area of the surface of the resist film, and an in-progress reaction area of the surface of the resist film, is moved from the center toward the periphery of the resist film.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: April 24, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Tomohiro Iseki, Yuichi Terashita
  • Publication number: 20180093205
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: November 21, 2017
    Publication date: April 5, 2018
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Patent number: 9878267
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: January 30, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20170296944
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 19, 2017
    Inventors: Kousuke YOSHIHARA, Katsunori ICHINO, Toshinobu FURUSHO, Takashi SASA, Katsuhiro TSUCHIYA, Yuichi TERASHITA, Hirofumi TAKEGUCHI
  • Patent number: 9731226
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 15, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Patent number: 9690202
    Abstract: A developing method includes: forming a puddle of a developer on a surface of the substrate held by the substrate holding unit by a first developer nozzle; subsequently spreading the puddle of the developer over the whole substrate surface, by moving the first developer nozzle discharging the developer from a central or peripheral part to the peripheral or central part of the rotating substrate, with a contacting part of the first developer nozzle contacting with the puddle; supplying the developer from a second developer nozzle onto the rotating substrate, thereby to uniformize, in the substrate plane, distribution of a degree of progress of development by the developer spreading step; and removing the developer between the developer spreading step and the developer supplying step to remove the developer on the substrate.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: June 27, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Yuichi Terashita, Hirofumi Takeguchi, Takeshi Shimoaoki, Kousuke Yoshihara, Tomohiro Iseki
  • Publication number: 20160070171
    Abstract: A developing method includes: forming a puddle of a developer on a surface of the substrate held by the substrate holding unit by a first developer nozzle; subsequently spreading the puddle of the developer over the whole substrate surface, by moving the first developer nozzle discharging the developer from a central or peripheral part to the peripheral or central part of the rotating substrate, with a contacting part of the first developer nozzle contacting with the puddle; supplying the developer from a second developer nozzle onto the rotating substrate, thereby to uniformize, in the substrate plane, distribution of a degree of progress of development by the developer spreading step; and removing the developer between the developer spreading step and the developer supplying step to remove the developer on the substrate.
    Type: Application
    Filed: September 4, 2015
    Publication date: March 10, 2016
    Inventors: Yuichi TERASHITA, Hirofumi TAKEGUCHI, Takeshi SHIMOAOKI, Kousuke YOSHIHARA, Tomohiro ISEKI
  • Patent number: 9256131
    Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: February 9, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Taro Yamamoto, Kousuke Yoshihara
  • Publication number: 20160026087
    Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.
    Type: Application
    Filed: July 17, 2015
    Publication date: January 28, 2016
    Inventors: Tomohiro ISEKI, Hirofumi TAKEGUCHI, Yuichi TERASHITA
  • Publication number: 20150362839
    Abstract: There is provided a developing method which can form a resist having a sufficiently high uniformity of CD distribution. The developing method for developing a resist film after exposure on a substrate surface to form a resist pattern, includes the sequential steps of: (A) supplying a developer to the rotating substrate; (B) reacting the resist film with the developer; and (C) removing the developer from the surface of the resist film to terminate the reaction of the resist film with the developer.
    Type: Application
    Filed: May 5, 2015
    Publication date: December 17, 2015
    Inventors: Hirofumi TAKEGUCHI, Tomohiro ISEKI, Yuichi TERASHITA
  • Patent number: 8956694
    Abstract: A pretreatment process, carried out prior to a developing process, spouts pure water, namely, a diffusion-assisting liquid for assisting the spread of a developer over the surface of a wafer, through a cleaning liquid spouting nozzle onto a central part of the wafer to form a puddle of pure water. The developer is spouted onto the central part of the wafer for prewetting while the wafer is rotated at a high rotating speed to spread the developer over the surface of the wafer. The developer dissolves the resist film partly and produces a solution. The rotation of the wafer is reversed, for example, within 7 s in which the solution is being produced to reduce the water-repellency of the wafer by spreading the solution over the entire surface of the wafer. Then, the developer is spouted onto the rotating wafer to spread the developer on the surface of the wafer.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: February 17, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Tomohiro Iseki, Yuichi Yoshida, Kousuke Yoshihara
  • Publication number: 20150000517
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 1, 2015
    Applicant: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20140347639
    Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.
    Type: Application
    Filed: August 6, 2014
    Publication date: November 27, 2014
    Inventors: Hirofumi TAKEGUCHI, Taro YAMAMOTO, Kousuke YOSHIHARA
  • Patent number: 8865396
    Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: October 21, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Taro Yamamoto, Kousuke Yoshihara
  • Patent number: 8469614
    Abstract: The present disclosure is a substrate treatment method of supplying a surface treatment liquid onto a surface of a substrate having a film with high water repellency formed thereon, the method including: a liquid puddle forming step of forming a liquid puddle of the surface treatment liquid by supplying the surface treatment liquid from a nozzle to one location of a peripheral portion of the substrate; and a liquid puddle moving step of then moving the liquid puddle formed at the peripheral portion of the substrate to a central portion of the substrate by moving the nozzle from a position above the peripheral portion of the substrate to a position above the central portion of the substrate while continuing the supply of the surface treatment liquid.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: June 25, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Yuichi Yoshida
  • Patent number: 8445189
    Abstract: The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: May 21, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Taro Yamamoto, Kousuke Yoshihara, Hideharu Kyouda, Hirofumi Takeguchi, Atsushi Ookouchi