Abstract: An object of this invention is to provide a thermoelectric apparatus, which is excellent in performance and has sufficiently high thermoelectric conversion ability.Supply means 6,7 for supplying a liquid heat transfer medium 21 against a side of a substrate with N-type semiconductor layers and P-type semiconductor layers supported thereon, said side being opposite to a semiconductor-layer-supporting side of the substrate, is arranged so that the liquid heat transfer medium 21 strikes against the opposite side of the substrate.

Abstract: A thermoelectric apparatus is composed of a heat-absorbing-side heat-exchanging base and a heat-dissipating-side heat-exchanging base having good thermal conductivity and arranged in a mutually opposing relationship with a group of thermoelectric elements interposed therebetween. The thermoelectric apparatus comprises a frame made of a synthetic resin material and holding one of the heat-absorbing-side heat-exchanging base and the heat-dissipating-side heat-exchanging base at an outer peripheral portion thereof. The frame and the other heat-exchanging base, which is not held by the frame, are both provided with extended portions extending substantially along and substantially in the same direction as a stacked direction of the heat-absorbing-side heat-exchanging base, the group of thermoelectric elements and the heat-dissipating-side heat-exchanging base. The extended portions are joined together.

Abstract: A temperature-controlled appliance is provided with mutually-independent temperature-controlled compartments arranged close to each other. Each of the compartments comprises a casing formed of a heat-insulating layer, a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite a storage space in the casing, a Peltier device thermally connected with the thermal conductor, a power supply for feeding electric power to the Peltier device, and a controller for controlling electric power to be fed to the Peltier device so that a temperature in the casing is controlled.

Abstract: A thermoelectric cooling device for a thermoelectric refrigerator is described. The device is composed of p-type and n-type semiconductor layers, a first inner heat conductor, a first outer heat conductor, a second inner heat conductor, and a second outer heat conductor. The p-type and n-type semiconductor layers are electrically connected in series via the electrodes. The p-type and n-type semiconductor layers have a specific average thickness. The average figures of merit of the p-type and n-type semiconductor layers are controlled to a particular value. The thermal conductances of the first and second, inner and outer heat conductors fall within specific ranges, respectively. The coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6. Also described are a process for the fabrication of a semiconductor suitable for use in the thermoelectric cooling device and also a thermoelectric refrigerator using the thermoelectric cooling device.