Patents by Inventor Hiroharu Okada

Hiroharu Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7003678
    Abstract: In an IC card 30 is sealed an IC chip 70 provided with an exposure sensor 84. When exposure sensor 84 detects that IC card 30 has been opened, exposure sensor 84 outputs an exposure detection signal to a CPU 76. In response to the exposure detection signal, CPU 76 provides a predetermined operation, such as erasure of data in a non-volatile memory 78. As such, the data in non-volatile memory 78 cannot be obtained if IC card 30 is improperly opened to check the data in non-volatile memory 78. Thus the IC card can obtain an enhanced data security.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: February 21, 2006
    Assignee: ROHM Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Hiroharu Okada
  • Publication number: 20050023361
    Abstract: In an IC card 30 is sealed an IC chip 70 provided with an exposure sensor 84. When exposure sensor 84 detects that IC card 30 has been opened, exposure sensor 84 outputs an exposure detection signal to a CPU 76. In response to the exposure detection signal, CPU 76 provides a predetermined operation, such as erasure of data in a non-volatile memory 78. As such, the data in non-volatile memory 78 cannot be obtained if IC card 30 is improperly opened to check the data in non-volatile memory 78. Thus the IC card can obtain an enhanced data security.
    Type: Application
    Filed: September 1, 2004
    Publication date: February 3, 2005
    Inventors: Yoshihiro Ikefuji, Hiroharu Okada
  • Patent number: 6802008
    Abstract: In an IC card 30 is sealed an IC chip 70 provided with an exposure sensor 84. When exposure sensor 84 detects that IC card 30 has been opened, exposure sensor 84 outputs an exposure detection signal to a CPU 76. In response to the exposure detection signal, CPU 76 provides a predetermined operation, such as erasure of data in a non-volatile memory 78. As such, the data in non-volatile memory 78 cannot be obtained if IC card 30 is improperly opened to check the data in non-volatile memory 78. Thus the IC card can obtain an enhanced data security.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: October 5, 2004
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Hiroharu Okada
  • Patent number: 6601770
    Abstract: An IC card (80) has a communication module (20) embedded in a core member (30). The communication module (20) has a contact terminal (24), an antenna (60) and an IC chip (82) mounted on the same circuit board (22) for making the assembly work easier. The contact terminal (24) is formed at an upper surface of the circuit board (22) to be exposed from an opening (26a) of a surface material (26). The antenna (60) and the IC chip (82) are provided to a lower surface of the circuit board (22) to indirectly face the contact terminal (24). The IC chip (82) automatically adjusts the resonance frequency of the antenna (60) such that an output from the antenna (60) has the maximum value constantly.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: August 5, 2003
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Hiroharu Okada
  • Patent number: 6422473
    Abstract: Oppositely arranged bumps (82,84) are electrically connected by connecting two IC chips (76,78) through an anisotropic conductor (80) to form an IC chip module (74). With IC chip module (74) having such structure, two IC chips (76,78) provided with functions of a processing portion and an antenna are simply stacked to provide a function for communication, and arrangement of interconnection outside IC chip (76,78) is not necessary. Thus, accidental breakage of the interconnection is avoided and assembly is extremely facilitated. Therefore, a circuit chip mounted card with higher reliability and reduced manufacturing cost and the like can be provided.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: July 23, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Shigemi Chimura, Hiroharu Okada
  • Publication number: 20020070280
    Abstract: Oppositely arranged bumps (82,84) are electrically connected by connecting two IC chips (76,78) through an anisotropic conductor (80) to form an IC chip module (74). With IC chip module (74) having such structure, two IC chips (76,78) provided with functions of a processing portion and an antenna are simply stacked to provide a function for communication, and arrangement of interconnection outside IC chip (76,78) is not necessary. Thus, accidental breakage of the interconnection is avoided and assembly is extremely facilitated. Therefore, a circuit chip mounted card with higher reliability and reduced manufacturing cost and the like can be provided.
    Type: Application
    Filed: June 22, 1999
    Publication date: June 13, 2002
    Inventors: YOSHIHIRO IKEFUJI, SHIGEMI CHIMURA, HIROHARU OKADA
  • Patent number: 6404644
    Abstract: A non-contact IC card (1, 2, 30, 50) includes a substrate (10), a coil (12, 32, 52, 57) provided on substrate (10), and an IC chip (11, 31, 51) electrically connected to a coil (12, 32, 52, 57) and having a main surface (11c, 31c, 51e). IC chip has a terminal (11a, 11b, 31a, 31b, 51a, 51b, 51c, 51d) formed in main surface (11c, 31c, 51e). Coil (12, 32, 52, 57) has a coil inner end (12b, 32b, 52b, 57b) electrically connected to a terminal (11b, 31b, 51b, 51d) and a coil outer end (12a, 32a, 52a, 57a) electrically connected to a terminal (11a, 31a, 51a, 57c). IC chip (11, 31, 51) is provided above coil (12, 32, 52, 57) such that coil inner end (12b, 32b, 52b, 57b) is positioned in vicinity of terminal (11b, 31b, 51b, 51d) and coil outer end (12a, 32a, 52a, 57a) is positioned in vicinity of terminal (11a, 31a, 51a, 51c).
    Type: Grant
    Filed: January 5, 2000
    Date of Patent: June 11, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Hiroharu Okada
  • Publication number: 20010040186
    Abstract: An IC card has, inside a card body, an IC chip and an antenna. To prevent breakage of the IC chip by an external bending force applied to the IC card, grooves are formed on both surfaces of the card body so as to surround the IC chip, or the portion of the card body surrounding the IC chip is made thinner than the remaining portions thereof. Even if a bending force is applied to the IC card, the card body bends along the grooves or the thinner portion. This reduces the bending force transmitted to the IC chip and thereby protect it. The grooves or the thinner portion may be formed so as to surround only the IC chip or both the IC chip and the antenna.
    Type: Application
    Filed: April 2, 1999
    Publication date: November 15, 2001
    Inventor: HIROHARU OKADA
  • Patent number: 6181001
    Abstract: A circuit chip mounted card has a processing-circuit layer 106 in which is constructed a processing unit including a non-volatile memory, a modulation/demodulation circuit and a capacitor for providing a process associated with communication. In the processing-circuit layer is also constructed a coil 44 of a looped metal wire. Communicating function is completely provided only by a single IC chip 104 with the function of the processing unit and that of an antenna integrated therewith. Thus IC chip 104 does not require external wiring and will thus not suffer from an accidentally cut-off wire or the like. It is also dispensed with an operation to connect wires so that the card can extremely readily be fabricated. Thus a circuit chip mounted card can be obtained which is highly reliable and reduces the cost for manufacturing the same.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: January 30, 2001
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshihiro Ikefuji, Shigemi Chimura, Hiroharu Okada