Patents by Inventor Hiroharu Ueda

Hiroharu Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7559819
    Abstract: A joining material like an In film having a low melting point forms a surface oxide film when melted. If the oxide film is thick, an uneven surface shape will remain as it is, and can cause vacuum leakage during vacuum sealing. This problem is solved, for example, by placing particles of a refractory material inside the low melting joining material. The particles of the refractory material serve as a holding member for the low melting material and break the oxide film during a joining operation to bring the seal bonding with the low melting material to perfection.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: July 14, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaki Tokioka, Hiroharu Ueda, Mitsutoshi Hasegawa, Tokutaka Miura
  • Patent number: 7119482
    Abstract: A joining material like an In film having a low melting point forms a surface oxide film when melted. If the oxide film is thick, an uneven surface shape will remain as it is, and can cause vacuum leakage during vacuum sealing. This problem is solved, for example, by placing particles of a refractory material inside the low melting joining material. The particles of the refractory material serve as a holding member for the low melting material and break the oxide film during a joining operation to bring the seal bonding with the low melting material to perfection.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: October 10, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaki Tokioka, Hiroharu Ueda, Mitsutoshi Hasegawa, Tokutaka Miura
  • Publication number: 20060194501
    Abstract: A joining material like an In film having a low melting point forms a surface oxide film when melted. If the oxide film is thick, an uneven surface shape will remain as it is, and can cause vacuum leakage during vacuum sealing. This problem is solved, for example, by placing particles of a refractory material inside the low melting joining material. The particles of the refractory material serve as a holding member for the low melting material and break the oxide film during a joining operation to bring the seal bonding with the low melting material to perfection.
    Type: Application
    Filed: May 1, 2006
    Publication date: August 31, 2006
    Inventors: Masaki Tokioka, Hiroharu Ueda, Mitsutoshi Hasegawa, Tokutaka Miura
  • Publication number: 20050103435
    Abstract: The present application discloses a method of manufacturing airtight vessels having a step of arranging a first substrate and a second substrate opposite to each other in a standing state, and a step of bonding to one of the first substrate and the second substrate a frame for forming an airtight vessel together with the first substrate and the second substrate, wherein, at the bonding step, a seal bonding member airtightly bonded to the frame and with one of the substrates is formed by, after successively supplying a sealing material heated to a temperature not lower than the temperature at which the bonding is possible in a state in which the first substrate and the second substrate are arranged opposite each other, solidifying after that the sealing material to form a seal bonding member.
    Type: Application
    Filed: October 21, 2004
    Publication date: May 19, 2005
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Masaki Tokioka, Mitsutoshi Hasegawa, Kazuo Koyanagi, Tokutaka Miura, Hiroharu Ueda
  • Publication number: 20040108057
    Abstract: The present invention relates to a method of manufacturing an airtight container and a method of manufacturing an image display apparatus. In particular, the invention discloses a method of manufacturing an airtight container, including the steps of: setting a member for defining an airtight space together with a substrate to abut on the substrate; supplying a seal bonding material to a corner portion formed by the substrate and the member or a portion to be the corner portion formed in the setting step; and forming a closed bonding line by performing airtight bonding of each of the substrate and the member with the seal bonding material by locally heating the seal bonding material to a temperature equal to or higher than a temperature that allows the airtight bonding and then curing the seal bonding material.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 10, 2004
    Applicant: Canon Kabushiki Kaisha
    Inventors: Masaki Tokioka, Hiroharu Ueda, Mitsutoshi Hasegawa, Kazuo Koyanagi, Tokutaka Miura
  • Patent number: 6621220
    Abstract: An envelope includes a face plate, a rear plate arranged so as to be opposite to the face plate, an outer frame arranged between the face and rear plates and surrounding a circumference, and a face plate joining portion for joining the outer frame and the face plate. A rear plate joining portion joins the outer frame and the rear plate to each other, with one or both of the face plate joining portion and the rear plate joining portion including a sealant having a seal function and an adhesive having an adhesive function.
    Type: Grant
    Filed: October 24, 2000
    Date of Patent: September 16, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsutoshi Hasegawa, Kazuya Shigeoka, Yutaka Arai, Hiroharu Ueda
  • Publication number: 20030067263
    Abstract: A joining material like an In film having a low melting point forms a surface oxide film when melted. If the oxide film is thick, an uneven surface shape will remain as it is, and can cause vacuum leakage during vacuum sealing. This problem is solved, for example, by placing particles of a refractory material inside the low melting joining material. The particles of the refractory material serve as a holding member for the low melting material and break the oxide film during a joining operation to bring the seal bonding with the low melting material to perfection.
    Type: Application
    Filed: August 28, 2002
    Publication date: April 10, 2003
    Inventors: Masaki Tokioka, Hiroharu Ueda, Mitsutoshi Hasegawa, Tokutaka Miura