Patents by Inventor Hirohide Yabuguchi

Hirohide Yabuguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9855734
    Abstract: Provided is a method of treating a wafer in the state where the wafer is fixed on a support plate with an adhesive composition. Although the wafer is treated by a chemical, heating, or exothermic treatment, the method achieves sufficient adhesiveness during the step of treating a surface of the wafer and allows detachment of the support plate from the wafer without damaging the wafer or leaving the adhesive on the wafer after the wafer treating step. The method of treating a wafer of the present invention includes the steps of: fixing a wafer on a support plate via an adhesive composition containing a curable adhesive component to be crosslinked and cured by light irradiation or heating; crosslinking and curing the curable adhesive component by light irradiation or heating of the adhesive composition; treating a surface of the wafer fixed on the support plate by a chemical, heating, or exothermic treatment; and detaching the support plate from the treated wafer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: January 2, 2018
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Takahiro Asao, Toru Tonegawa, Kozo Ueda, Hirohide Yabuguchi
  • Publication number: 20150217552
    Abstract: Provided is a method of treating a wafer in the state where the wafer is fixed on a support plate with an adhesive composition. Although the wafer is treated by a chemical, heating, or exothermic treatment, the method achieves sufficient adhesiveness during the step of treating a surface of the wafer and allows detachment of the support plate from the wafer without damaging the wafer or leaving the adhesive on the wafer after the wafer treating step. The method of treating a wafer of the present invention includes the steps of: fixing a wafer on a support plate via an adhesive composition containing a curable adhesive component to be crosslinked and cured by light irradiation or heating; crosslinking and curing the curable adhesive component by light irradiation or heating of the adhesive composition; treating a surface of the wafer fixed on the support plate by a chemical, heating, or exothermic treatment; and detaching the support plate from the treated wafer.
    Type: Application
    Filed: August 6, 2013
    Publication date: August 6, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Takahiro Asao, Toru Tonegawa, Kozo Ueda, Hirohide Yabuguchi