Patents by Inventor Hirohiko Fujimaki
Hirohiko Fujimaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7612639Abstract: There is provided a relay module including: a power lead part connected to a power source; a connector lead part connected to a load; a relay switch interposed between the power lead part and the connector lead part, and electrically connected thereto; a control member for controlling the relay switch; and a molded part sealing at least ends of the power lead part and the connector lead part near the control member, the relay switch, and the control member.Type: GrantFiled: October 19, 2006Date of Patent: November 3, 2009Assignee: Yazaki CorporationInventor: Hirohiko Fujimaki
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Patent number: 7581964Abstract: A unit with a built-in control circuit includes an outer housing and a control circuit package. The outer housing includes an electric wire holding part and receives the control circuit package. The control circuit package includes a lead frame, an IC chip, and a plastic molding body. The lead frame is made of conductive metal, and includes crimping terminals 20 and male tabs. The electric wire is press-fitted into the crimping terminal. The male tabs are connected to a mating connector. The IC chip is mounted on the lead frame. The plastic molding body covers and receives the IC chip and a center part of the lead frame.Type: GrantFiled: December 31, 2007Date of Patent: September 1, 2009Assignee: Yazaki CorporationInventors: Hirohiko Fujimaki, Ryuji Matsuura
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Patent number: 7497698Abstract: An electrical module and electrical unit, by which workability of the connection work can be improved without deteriorating reliability of the connection, are provided. The electrical module includes: a receiving member for receiving electronic components; a plurality of terminals extending outside the receiving member on a condition that the terminals are electrically connected to the electronic components, the terminals being loosely inserted in insertion holes of a connector so that the electrical module is connected to the connector; a positioning means for positioning the terminals with regard to the insertion holes of the connector; and a fixing means for fixing the receiving member at a position positioned by the positioning means.Type: GrantFiled: August 2, 2006Date of Patent: March 3, 2009Assignee: Yazaki CorporationInventor: Hirohiko Fujimaki
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Publication number: 20090009978Abstract: The present invention is to provide an inexpensive electric connection box and a manufacturing method thereof, which can reduce manufacturing process and a number of parts. The electric connection box has a bus bar arranged on another member different from the board, and a circuit element mounted on a board. A power source lead connected to an electric source is arranged on a part of the bus bar. Also, a semiconductor relay, which is electrically connected between the power source lead and a connector lead connected with a wire from a load, is mounted on the bus bar. A board supporting part for supporting the board and a bus bar supporting part for supporting the bus bar are arranged on a case body. The bus bar supporting part is provided on another area different from the board supporting part.Type: ApplicationFiled: June 23, 2008Publication date: January 8, 2009Applicant: Yazaki CorporationInventor: Hirohiko Fujimaki
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Publication number: 20080176423Abstract: A unit with a built-in control circuit includes an outer housing and a control circuit package. The outer housing includes an electric wire holding part and receives the control circuit package. The control circuit package includes a lead frame, an IC chip, and a plastic molding body. The lead frame is made of conductive metal, and includes crimping terminals 20 and male tabs. The electric wire is press-fitted into the crimping terminal. The male tabs are connected to a mating connector. The IC chip is mounted on the lead frame. The plastic molding body covers and receives the IC chip and a center part of the lead frame.Type: ApplicationFiled: December 31, 2007Publication date: July 24, 2008Applicant: Yazaki CorporationInventors: Hirohiko Fujimaki, Ryuji Matsuura
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Publication number: 20070093090Abstract: There is provided a relay module including: a power lead part connected to a power source; a connector lead part connected to a load; a relay switch interposed between the power lead part and the connector lead part, and electrically connected thereto; a control member for controlling the relay switch; and a molded part sealing at least ends of the power lead part and the connector lead part near the control member, the relay switch, and the control member.Type: ApplicationFiled: October 19, 2006Publication date: April 26, 2007Applicant: YAZAKI CORPORATIONInventor: Hirohiko Fujimaki
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Publication number: 20070049070Abstract: An electrical module and electrical unit, by which workability of the connection work can be improved without deteriorating reliability of the connection, are provided. The electrical module includes: a receiving member for receiving electronic components; a plurality of terminals extending outside the receiving member on a condition that the terminals are electrically connected to the electronic components, the terminals being loosely inserted in insertion holes of a connector so that the electrical module is connected to the connector; a positioning means for positioning the terminals with regard to the insertion holes of the connector; and a fixing means for fixing the receiving member at a position positioned by the positioning means.Type: ApplicationFiled: August 2, 2006Publication date: March 1, 2007Applicant: YAZAKI CORPORATIONInventor: Hirohiko Fujimaki
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Publication number: 20020007878Abstract: A carbide dispersed, strengthened copper alloy includes copper as a major constituent, carbide particles, and a dispersing agent. The carbide particles consist of one or more carbides selected from chromium carbide, tungsten carbide, molybdenum carbide, and tantalum carbide. The dispersing agent consists of one or more elements selected from magnesium, chromium, silicon, and aluminum.Type: ApplicationFiled: August 21, 2001Publication date: January 24, 2002Applicant: Yazaki CorporationInventors: Takao Choh, Hirohiko Fujimaki, Yuji Nitta, Takuya Miyakawa
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Patent number: 6299708Abstract: A carbide dispersed, strengthened copper alloy includes copper as a major constituent, carbide particles, and a dispersing agent. The carbide particles consist of one or more carbides selected from chromium carbide, tungsten carbide, molybdenum carbide, and tantalum carbide. The dispersing agent consists of one or more elements selected from magnesium, chromium, silicon, and aluminum.Type: GrantFiled: July 27, 1998Date of Patent: October 9, 2001Assignee: Yazaki CorporationInventors: Takao Choh, Hirohiko Fujimaki, Yuji Nitta, Takuya Miyakawa
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Patent number: 5830257Abstract: A manufacturing method for an alumina-dispersed reinforced copper alloy according to the invention is an improved method which is capable of manufacturing efficiently alumina-dispersed reinforced copper having both good electro-conductivity used for wire-manufacturing-material and good mechanical property, the manufacturing method comprises the steps of obtaining powders constituted by particles having aluminum-contained copper alloy-oxide, allowing to mill aluminum-contained copper alloy powder within the air atmosphere by milling device with mechanical-alloying-operation due to shock compression, converting aluminum into aluminum-oxide by heat-treatment of the powders within inert atmosphere, implementing reduction-treatment of the converted member within the reducing atmosphere, and executing hot extrusion the reduction-treated-material.Type: GrantFiled: August 22, 1996Date of Patent: November 3, 1998Assignee: Yazaki CorporationInventors: Hirohiko Fujimaki, Manabu Kiuchi, Tetsuya Takaai, deceased
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Patent number: 5239749Abstract: A method and apparatus for interconnecting cables to improve electrical characteristics of the connected cables. The apparatus comprises a terminal having clamping pieces integrally formed respectively on opposite sides of a base portion of the terminal. The conductor wires of the cables are arranged in layers on the base portion, and the clamping pieces are press-clamped in the direction in which the conductor wires are layered. The method comprises the steps of placing conductor wires of one cable on a base portion of a terminal having clamping pieces integrally formed respectively on opposite sides of said base portion; compressing the conductor wires so as to form a surface of the conductor wires into a flattened configuration; placing conductor wires of another cable on the surface in a layered manner; and press-clamping the clamping pieces in the direction in which the conductor wires of the two cables as layered one upon the other.Type: GrantFiled: September 30, 1992Date of Patent: August 31, 1993Assignee: Yazaki CorporationInventors: Hirohiko Fujimaki, Kazuhito Sano
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Patent number: 5191710Abstract: A forming electrode unit for forming the conductors of the electric wire into the terminal includes a female pressing electrode having an electric wire housing groove, and a male pressing electrode having an electric wire pressing portion which is fitted in the groove in such a manner that a clearance is defined between the pressing portion and the female pressing electrode. To form the conductors together into the terminal, the conductors are set in the groove, and thereafter pressed by the pressing portion as an electrical current is caused to flow through the electrodes and the conductors to heat the conductors. The electric wire is thus integrally provided with the solidly formed terminal.Type: GrantFiled: December 31, 1991Date of Patent: March 9, 1993Assignee: Yazaki CorporationInventors: Hirohiko Fujimaki, Kazuhito Sano
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Patent number: 4944084Abstract: A fuse comprising a fuse element made by fixing a low-melting-point metal chip to a high-melting-point metal conductor, in which oxidatoin of the portions of the metal chip that are in contact with the metal conductor is prevented by [either partially fusing or soldered the metal chip to the metal conductor, or by] forming a layer of oxidation resistant material over the metal chip and then partially fusing the metal chip to the metal conductor.Type: GrantFiled: March 22, 1989Date of Patent: July 31, 1990Assignee: Yazaki CorporationInventors: Kinya Horibe, Hirohiko Fujimaki