Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, the light being a mixture of light emitted from a plurality of light-emitting elements mounted densely and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, a plurality of light-emitting elements mounted densely on the board, a first resin free from any phosphor, placed among the plurality of light-emitting elements, and a second resin containing a phosphor and covering an exposed part of the plurality of light-emitting elements.

Abstract: A light-emitting device is provided whose color mixing property and light emission efficiency are improved, while white light with high color rendering performance is ensured by means of four kinds of LED elements emitting red, green, blue, and white light respectively.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, wherein the light is a mixture of light emitted from densely-mounted light-emitting elements and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, light-emitting elements mounted densely on the board so that light-emitting surfaces thereof face opposite to the board, and a seal resin containing a plurality of different phosphors and covering all of the light-emitting elements, wherein the phosphors are excited by light from the light-emitting elements and deposited on upper surfaces of the light-emitting elements. A space between adjacent light-emitting elements has a length of 5 ?m or more and 120% or less of a median diameter D50 of a phosphor which has the largest average particle size of the phosphors.

Abstract: An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

Abstract: A light-emitting device is provided whose color mixing property and light emission efficiency are improved, while white light with high color rendering performance is ensured by means of four kinds of LED elements emitting red, green, blue, and white light respectively.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, wherein the light is a mixture of light emitted from densely-mounted light-emitting elements and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, light-emitting elements mounted densely on the board so that light-emitting surfaces thereof face opposite to the board, and a seal resin containing a plurality of different phosphors and covering all of the light-emitting elements, wherein the phosphors are excited by light from the light-emitting elements and deposited on upper surfaces of the light-emitting elements. A space between adjacent light-emitting elements has a length of 5 ?m or more and 120% or less of a median diameter D50 of a phosphor which has the largest average particle size of the phosphors.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, the light being a mixture of light emitted from a plurality of light-emitting elements mounted densely and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, a plurality of light-emitting elements mounted densely on the board, a first resin free from any phosphor, placed among the plurality of light-emitting elements, and a second resin containing a phosphor and covering an exposed part of the plurality of light-emitting elements.

Abstract: An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

Abstract: Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

Abstract: A method for manufacturing a semiconductor light emitting device comprises steps of: arraying semiconductor light emitting elements on an adhesive sheet so that electrodes of the semiconductor light emitting elements face the adhesive sheet; forming a wafer thereof by filling spaces between side surfaces of the semiconductor light emitting elements arrayed on the adhesive sheet with a resin and curing the resin; peeling the adhesive sheet from the wafer; overlaying the wafer on a substrate from which numerous substrates can be obtained by subdivision into individual pieces and the electrodes of the semiconductor light emitting elements and electrodes formed on the large circuit substrate are joined; and subdividing the large circuit substrate, to which the wafer has been joined, into individual semiconductor light emitting devices so that the planar size of the semiconductor light emitting element and that of the circuit substrate are roughly equal.

Abstract: A method for manufacturing a semiconductor light emitting device comprises step of: arraying semiconductor light emitting elements on an adhesive sheet so that electrodes of the semiconductor light emitting elements face the adhesive sheet; forming a wafer thereof by filling spaces between side surfaces of the semiconductor light emitting elements arrayed on the adhesive sheet with a resin and curing the resin; peeling the adhesive sheet from the wafer; overlaying the wafer on a substrate from which numerous substrates can be obtained by subdivision into individual pieces and the electrodes of the semiconductor light emitting elements and electrodes formed on the large circuit substrate are joined; and subdividing the large circuit substrate, to which the wafer has been joined, into individual semiconductor light emitting devices so that the planar size of the semiconductor light emitting element and that of the circuit substrate are roughly equal.

Abstract: Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

Abstract: An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.

Abstract: A semiconductor light-emitting device includes: a printed-wiring board; a light-emitting diode element mounted on the printed-wiring board; and a resin body for sealing the light-emitting diode element. The resin body is composed of a first resin body arranged around the light-emitting diode element, and a second resin body, which seals the light-emitting diode and the first resin body. An upper edge of the first resin body disposed at a lower position of the PN-junction is configured to be at least on or beyond an imaginary line that connects the PN-junction and a lower edge of the second resin body.

Abstract: An illumination device includes a circuit board (11), an LED element (12) mounted on the circuit board, a light-transmitting sealing resin (16) covering the LED element and containing a fluorescent material, a light reflector (14) covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part (13) comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface (13a) configured to emit the light.

Abstract: An LED includes a printed circuit board, at least one LED element including a junction and mounted on the printed circuit board, a first sealing member disposed to cover side surfaces of the LED element, and a second sealing member disposed to cover side surfaces of the LED element. The first sealing member is configured to reflect and shield light emitted from the junction of the LED element, and the second sealing member is configured to transmit light emitted from the LED element.

Abstract: A semiconductor light-emitting device includes: a printed-wiring board 3; a light-emitting diode element 2 mounted on the printed-wiring board 3; and a resin body for sealing the light-emitting diode element 2. The resin body is composed of a first resin body 7 arranged around the light-emitting diode element 2, and a second resin body 8 which seals the light-emitting diode 2 and the first resin body 7. An upper edge of the first resin body 7 disposed at a lower position of the junction is configured to be at least on or beyond an imaginary line that connects the junction and a lower edge of the second resin body.

Abstract: A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the individual transparent layer. The groove is filled with a reflector material to form a reflector layer. The reflector layer and the substrate are cut so as to form a reflector film on the outside wall of the individual transparent layer, thereby forming a plurality of LED devices.

Abstract: A light emitting apparatus including one diode package, the diode package including a plurality of LED chips connected in parallel with an anode side common electrode and a cathode side common electrode, the plurality of LED chips being set so that a voltage is applied to each of the LED chips in a forward direction.

Abstract: A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.