Patents by Inventor Hirohiko Saito

Hirohiko Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109157
    Abstract: In an example, use of a solder joint may include a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a Ni—P—Cu plating layer on a surface of the joined body in contact with the solder joint layer. The Ni—P—Cu plating layer may contain Ni as a main component and may contain 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, and the Ni—P—Cu plating layer may have a microcrystalline layer at an interface with the solder joint layer.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hirohiko WATANABE, Shunsuke SAITO, Takeshi YOKOYAMA
  • Publication number: 20240075559
    Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hirohiko WATANABE, Shunsuke SAITO, Yoshihiro KODAIRA
  • Publication number: 20220383685
    Abstract: A paper sheet handling apparatus includes: a displacement amount detector that includes a pressing part intended to press a paper sheet against a transporting face of a paper sheet transporting path and having an initial position at which the pressing part is not in contact with the transporting face of the paper sheet transporting path, the displacement amount detector detecting a displacement amount of displacement of the pressing part from the initial position in a direction perpendicular to the transporting face, the pressing part being displaced according to a thickness of a paper sheet passing between the transporting face and the pressing part; a reference displacement amount storage; a paper sheet thickness storage; and a tape thickness threshold storage.
    Type: Application
    Filed: August 11, 2022
    Publication date: December 1, 2022
    Inventors: Yoshitaku YOSHIMATSU, Hirohiko SAITO, Kazuya ASOO
  • Patent number: 6589582
    Abstract: Baked, fried or steamed goods or foodstuffs exerting wheat flour's specific flavor and taste and having a unique flavor can be made characteristically through a process comprising a first step of preparing first a basic dough by mixing wheat flour and water and kneading the mixture under heating to give a basic dough having a temperature of around 55 to 98° C., an additional step of preparing a finished dough by mixing the basic dough, wheat flour and auxiliary materials containing yeast and subsequently kneading the mixture, and a last step of subjecting the finished dough to fermentation and subsequently baking, frying or steaming the fermented dough into baked, fried or steamed goods or foodstuffs.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 8, 2003
    Assignee: Okumoto Flour Milling Co., Ltd.
    Inventors: Hirohiko Saito, Norihiro Kanaya, Etsuko Homma, Shuichi Murata
  • Publication number: 20020031575
    Abstract: Baked, fried or steamed goods or foodstuffs exerting wheat flour's specific flavor and taste and having a unique flavor can be made characteristically through a process comprising a first step of preparing first a basic dough by mixing wheat flour and water and kneading the mixture under heating to give a basic dough having a temperature of around 55 to 98° C., an additional step of preparing a finished dough by mixing the basic dough, wheat flour and auxiliary materials containing yeast and subsequently kneading the mixture, and a last step of subjecting the finished dough to fermentation and subsequently baking, frying or steaming the fermented dough into baked, fried or steamed goods or foodstuffs.
    Type: Application
    Filed: June 25, 2001
    Publication date: March 14, 2002
    Inventors: Hirohiko Saito, Norihiro Kanaya, Etsuko Homma
  • Patent number: 5972539
    Abstract: A flame retardant solid electrolyte comprising an ion conductive polymer matrix having moieties capable of imparting flame retardance to the polymer matrix and ether bonds in the molecule and an electrolyte salt dispersed in the polymer matrix. The flame retardant solid electrolyte may be one which comprises a non-ion-conductive polymer matrix and a liquid electrolyte consisting of an electrolyte salt dissolved in a solvent therefor, which is dispersed in the polymer matrix. The flame retardance-imparting moieties are derived from halogen or phosphorus-bearing compounds.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: October 26, 1999
    Assignees: Denso Corporation, Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Jun Hasegawa, Hiromochi Muramatsu, Hirohiko Saito, Michiyuki Kono, Hirohito Komori
  • Patent number: 5494762
    Abstract: In order to improve the charge-discharge energy density of a lithium secondary cell with a nonaqueous electrolyte having such a construction that a metallic compound capable of occluding or releasing lithium is used as an electrode active material, lithium or a lithium alloy is used as a negative electrode material and a solution of a lithium salt is used as an electrolyte, the microstructure of the metallic compound is rendered acicular. Further, a lithium-containing metallic compound grown into such a columnar form that has the angle .THETA. to the normal of the surface of the substrate of 0.degree..ltoreq..THETA.<90.degree. is used as the electrode active material.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: February 27, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hirofumi Isoyama, Satoru Suzuki, Jun Hasegawa, Hirohiko Saito, Hisano Kojima
  • Patent number: 4962411
    Abstract: A semiconductor device with a current detecting function in which in place of an external resistor for detecting an operation current such as drain current or collector current of a device such as an FET or bipolar transistor, a probe electrode is formed in proximity to the device depletion layer to connect therethrough with the device channel to generate a probe voltage corresponding to the operation current.
    Type: Grant
    Filed: February 3, 1989
    Date of Patent: October 9, 1990
    Assignee: Nippondenso Co., Ltd.
    Inventors: Norihito Tokura, Hironari Kuno, Hiroyasu Ito, Hirohiko Saito, Kunihiko Hara