Abstract: It is an object of the invention to provide a cleaning apparatus which can subject wafers that have undergone polishing to various cleaning processes while reducing the usage amount of pure water, increase the processing speed of wafers per unit floor area and significantly improve the operating rate, enable change or rearrangement of a plurality of cleaning processing chambers to more optimum arrangement in accordance with the cleaning treatment processes and the like, prevent generation of defects in wafers that are in process of, for example, pre-treatment, and simplify the configuration of the apparatus.

Abstract: An open type casting mold suitably used for continuously casting metals having a large temperature difference between the melting point and the solidifying point thereof, said casting mold comprising a water-cooling jacket, a 1st stage die portion of other refractory material than graphite inserted in the mold at the inlet portion, said refractory material having a lubricating action with slight abrasion, and a 2nd stage die portion of graphite inserted in the mold at the outlet portion, said 1st stage die portion extending over the back end of the water-cooling jacket into a pouring basin side for a definite length.Better results are obtained by covering the outer surface of the extended portion of the 1st stage die portion with a fixing member of a refractory material, fixing the fixing member of refractory material to the 1st stage die portion by means of a metallic protecting member, and fixing the metallic protecting member to the water-cooling jacket.