Abstract: A semiconductor device includes an insulating film formed over a semiconductor substrate, a Zener diode formed above the insulating film, an interlayer film formed above the Zener diode, and a gate aluminum and a source aluminum formed above the interlayer film. The Zener diode is connected between the gate aluminum and the source aluminum. The Zener diode is formed by alternately joining an N type region and a P type region concentrically. The gate electrode includes a gate pad section. A planar shape of the Zener diode is substantially similar to a planer shape of the gate pad section. The gate pad section extends for a predetermined distance from an outermost edge of the P type region of the Zener diode to outside.

Abstract: Provided are a semiconductor device capable of reducing a difference in wiring resistance between paths from a gate pad to a gate electrode and capable of applying a gate voltage to the gate electrode more uniformly, and a method of manufacturing the semiconductor device. The semiconductor device according to an exemplary aspect of the present invention includes a gate pad supplied with a gate voltage applied to a gate electrode of each MOSFET cell disposed in an active region, a gate connection line connected to the gate pad, and a plurality of gate lead-out lines connected in parallel between the gate electrode and the gate connection line. Each of the plurality of gate lead-out lines has a resistance value that becomes smaller by every one or plural gate lead-out lines as the gate lead-out lines are located farther away from the gate pad.

Abstract: A semiconductor device includes an insulating film formed over a semiconductor substrate, a Zener diode formed above the insulating film, an interlayer film formed above the Zener diode, and a gate aluminum and a source aluminum formed above the interlayer film. The Zener diode is connected between the gate aluminum and the source aluminum. The Zener diode is formed by alternately joining an N type region and a P type region concentrically. The gate electrode includes a gate pad section. A planar shape of the Zener diode is substantially similar to a planer shape of the gate pad section. The gate pad section extends for a predetermined distance from an outermost edge of the P type region of the Zener diode to outside.

Abstract: A semiconductor device includes a semiconductor body having grooves, unit cell regions surrounded by the grooves, and at least a field relaxation region separated by the grooves from the unit cell regions. A gate insulating film extends within the grooves and over the field relaxation regions. Gate electrodes extend over the gate insulating film, and inter-layer insulators cover the gate electrodes. A top electrode extends over the inter-layer insulators and is in contact with parts of the unit cell regions, and the top electrode has a generally flat upper surface.

Abstract: The present invention provides a semiconductor device comprising: a semiconductor body having grooves, unit cell regions surrounded by the grooves, at least a field relaxation region separated by the grooves from the unit cell regions; gate insulating films extending within the grooves and over the field relaxation regions; gate electrodes extending over the gate insulating film; inter-layer insulators covering the gate electrodes; and a top electrode extending over the inter-layer insulators and in contact with parts of the unit cell regions, and the top electrode having a generally flat upper surface.

Abstract: A semiconductor device has formed onto the surface of a collector region 12 of a semiconductor substrate 11 of one conductivity type with a base region 13 of a different conductivity type, an emitter region 16 of the one conductivity type formed on a surface within the base region 13, and a base electrode 18 and emitter electrode 17 which are formed by opening windows in the base and emitter regions 13, 16.