Abstract: A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.

Abstract: A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

Abstract: A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.

Abstract: Provided herein is a solder paste that can be used for solder connection requiring a high melting point, while, at the same time, ensuring excellent applicability, high adhesion, and excellent solder joint reliability. A mount structure mounting an electronic component with such a solder paste is also provided. The solder paste is a solder paste that includes a solder powder and a flux. The flux contains an epoxy resin, a phenolic resin, a benzooxazine compound, and an activating agent. The phenolic resin contains at least one type of phenolic resin having a phenolic hydroxyl group and an allyl group within the molecule.

Abstract: An electrolytic capacitor includes a capacitor element, a case housing the capacitor element, and a first heat radiation layer having an insulating property. The first heat radiation layer covers at least part of the capacitor element. A thermal conductivity ?C of the case in a thickness direction is greater than or equal to 1 W/m·K. A thermal emissivity ?1 of the first heat radiation layer is greater than or equal to 0.7.

Abstract: A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 ?m to 20 ?m; and a filler having a grain diameter of 15 ?m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 ?m to 20 ?m.

Abstract: Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa·s or more and 700 mPa·s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.

Abstract: A heat insulator is provided that has a coating structure preventing separation of silica aerogel in a composite sheet. The heat insulator includes: a composite layer having silica aerogel enclosed in a nonwoven fabric; and a coating film containing a hydrophilic resin and a lipophilic resin and coating a surface of the composite layer. The nonwoven fabric resides in the coating film. In the coating film, the heat insulator includes the lipophilic resin which is present in the hydrophilic resin in the form of a plurality of islands.

Abstract: Provided is a heat insulating material having improved adhesion of interface between a porous body and a polymeric cover material, and a method for forming a coating of the heat insulating material. The heat insulating material includes a composite material containing an aerogel in a nonwoven fabric, and a cover material including a fluororesin for covering the composite material, in which the cover material has a plurality of grain boundaries on a surface of the cover material.

Abstract: A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

Abstract: Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a flux. The flux contains an epoxy resin, a curing agent, a rubber modified epoxy resin, and an organic acid. The rubber modified epoxy resin is contained in a proportion of 3 weight % to 35 weight % with respect to the total weight of the flux.

Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 ?m to 150 ?m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.

Abstract: Provided herein is a structure having desirable heat dissipation, particularly a structure having high far-infrared emissivity. An electronic component including such a structure, and an electronic device including the electronic component are also provided. The structure includes a water-based coating material containing inorganic fillers that include a first filler and a second filler. The first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m2/g to 50 m2/g, and a hydrophobic group on a filler surface. The second filler has a head conductivity of 30 W/m·K or more.

Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 ?m to 150 ?m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Abstract: A solder paste having improved self alignment for soldering is provided. The solder paste includes a solder powder; a composite epoxy resin containing a first epoxy resin that is solid at 25° C., and a second epoxy resin that is liquid at 25° C.; and a curing agent, wherein the first epoxy resin has a softening point that is at least 10° C. lower than the melting point of the solder powder, and is contained in a range of 10 weight parts to 75 weight parts with respect to the total 100 weight parts of the composite epoxy resin.

Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.