Patents by Inventor Hirohisa HIRAI

Hirohisa HIRAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
    Publication number: 20240213364
    Abstract: There is provided a semiconductor equipment including: an element area having an n-type layer, a first p-type layer on the n-type layer, and a second p-type layer on the first p-type layer, the second p-type layer having an acceptor concentration higher than the first p-type layer; and an electric field relaxation region surrounding the element area, in which in the electric field relaxation region, a region containing an impurity element that inactivates a part of acceptors in the first p-type layer and the second p-type layer is provided in the first p-type layer and the second p-type layer.
    Type: Application
    Filed: April 15, 2022
    Publication date: June 27, 2024
    Inventors: Yoshinao MIURA, Akira NAKAJIMA, Xu-Qiang SHEN, Hirohisa HIRAI, Shinsuke HARADA