Patents by Inventor Hirohisa Imada

Hirohisa Imada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12180315
    Abstract: Provided are an elastomer composition including a first fluoroelastomer that is a copolymer of tetrafluoroethylene and perfluoro (alkoxyvinyl ether) and a second fluoroelastomer different from the first fluoroelastomer, and a sealing material including a crosslinked product of the elastomer composition.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: December 31, 2024
    Assignee: VALQUA, LTD.
    Inventors: Naoki Osumi, Hirohisa Imada, Tomomitsu Mochizuki
  • Publication number: 20220041773
    Abstract: Provided are an elastomer composition including a first fluoroelastomer that is a copolymer of tetrafluoroethylene and perfluoro (alkoxyvinyl ether) and a second fluoroelastomer different from the first fluoroelastomer, and a sealing material including a crosslinked product of the elastomer composition.
    Type: Application
    Filed: December 2, 2019
    Publication date: February 10, 2022
    Applicant: VALQUA, LTD.
    Inventors: Naoki Osumi, Hirohisa Imada, Tomomitsu Mochizuki
  • Patent number: 9688896
    Abstract: A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 27, 2017
    Assignee: NIPPON VALQUA INDUSTRIES, LTD.
    Inventor: Hirohisa Imada
  • Patent number: 9441107
    Abstract: A shaped product obtained by allowing a polymer (A) and a compound (B) to undergo hydrosilylation reaction, the polymer (A) and the compound (B) being contained in an uncrosslinked composition including the polymer (A), the compound (B) and a functional filler (C), wherein the polymer (A) is crosslinked by the compound (B) and the resulting crosslinked product is filled with the functional filler (C) dispersed therein, the polymer (A) includes (A1) a polymer of a perfluoropolyether skeleton having one alkenyl group and (A2) a polymer of a perfluoropolyether skeleton having two hydrosilyl [SiH] groups, the compound (B) includes (B1) a compound having two alkenyl groups and/or (B2) a compound having three hydrosilyl groups, and in the uncrosslinked composition, the content of the polymer (A) is 50 to 98 parts by weight based on 100 parts by weight of the total amount of the polymer (A) and the compound (B), and the content of the functional filler (C) is 50 to 500 parts by weight based on 100 parts by weight of
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: September 13, 2016
    Assignee: Nippon Valqua Industries, Ltd.
    Inventors: Hirohisa Imada, Tomoaki Yokota
  • Publication number: 20150240075
    Abstract: A shaped product obtained by allowing a polymer (A) and a compound (B) to undergo hydrosilylation reaction, the polymer (A) and the compound (B) being contained in an uncrosslinked composition including the polymer (A), the compound (B) and a functional filler (C), wherein the polymer (A) is crosslinked by the compound (B) and the resulting crosslinked product is filled with the functional filler (C) dispersed therein, the polymer (A) includes (A1) a polymer of a perfluoropolyether skeleton having one alkenyl group and (A2) a polymer of a perfluoropolyether skeleton having two hydrosilyl [SiH] groups, the compound (B) includes (B1) a compound having two alkenyl groups and/or (B2) a compound having three hydrosilyl groups, and in the uncrosslinked composition, the content of the polymer (A) is 50 to 98 parts by weight based on 100 parts by weight of the total amount of the polymer (A) and the compound (B), and the content of the functional filler (C) is 50 to 500 parts by weight based on 100 parts by weight of
    Type: Application
    Filed: August 22, 2013
    Publication date: August 27, 2015
    Inventors: Hirohisa Imada, Tomoaki Yokota
  • Publication number: 20150014578
    Abstract: A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.
    Type: Application
    Filed: September 30, 2014
    Publication date: January 15, 2015
    Inventor: Hirohisa IMADA
  • Patent number: 8912278
    Abstract: A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 16, 2014
    Assignee: Nippon Valqua Industries, Ltd.
    Inventor: Hirohisa Imada
  • Publication number: 20130240778
    Abstract: A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20 and (A1)/(B1) and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 19, 2013
    Applicant: NIPPON VALQUA INDUSTRIES, LTD.
    Inventor: Hirohisa IMADA
  • Publication number: 20110303361
    Abstract: Because an O-ring of synthetic resin is pyrolyzed in the atmosphere at a high temperature of 150° C. or more, the airtightness cannot be maintained. In an outside air shut-off container according to the present invention, an inert gas is supplied between an O-ring, which hermetically seals a process chamber and a cover member, and the outside air while a gas passage formed between the O-ring and the outside air is covered with a sealing cover. Additionally, an aluminum oxide layer is formed on a contact surface of the O-ring to increase the pyrolysis temperature of the O-ring.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 15, 2011
    Inventors: Tadahiro OHMI, Yasuyuki Shirai, Hirohisa Imada, Tsutomu Yoshida