Patents by Inventor Hirohisa Narahashi
Hirohisa Narahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11482437Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.Type: GrantFiled: March 19, 2020Date of Patent: October 25, 2022Assignee: Ajinomoto Co., Inc.Inventors: Masanori Ohkoshi, Hirohisa Narahashi, Eiichi Hayashi
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Patent number: 11121020Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.Type: GrantFiled: April 12, 2017Date of Patent: September 14, 2021Assignee: Ajinomoto Co., Inc.Inventors: Masanori Ohkoshi, Hirohisa Narahashi, Eiichi Hayashi
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Publication number: 20200219750Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.Type: ApplicationFiled: March 19, 2020Publication date: July 9, 2020Applicant: Ajinomoto Co, Inc.Inventors: Masanori OHKOSHI, Hirohisa NARAHASHI, Eiichi HAYASHI
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Publication number: 20170290148Abstract: Printed wiring boards with reduced curing unevenness and the like may be produced by (A) preparing an adhesive sheet having a support and a resin composition layer provided on the support, (B) laminating the adhesive sheet on an internal layer substrate so that the resin composition layer is in contact with the internal layer substrate, and (C) thermally curing the adhesive sheet by heating from T1 (° C.) to T2 (° C.), to form an insulating layer, wherein the adhesive sheet is thermally cured so that a relation of Y>2700X is satisfied in which X is the sum of a difference between a maximum expansion rate of the support in the MD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and a difference between a maximum expansion rate of the support in the TD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and Y is the lowest melt viscosity of the resin composition layer at 120° C.Type: ApplicationFiled: March 28, 2017Publication date: October 5, 2017Applicant: AJINOMOTO CO., INC.Inventors: Masanori OHKOSHI, Hirohisa NARAHASHI
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Publication number: 20170221745Abstract: A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.Type: ApplicationFiled: April 12, 2017Publication date: August 3, 2017Applicant: Ajinomoto Co., IncInventors: Masanori OHKOSHI, Hirohisa Narahashi, Eiichi Hayashi
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Patent number: 8584352Abstract: Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.Type: GrantFiled: August 27, 2010Date of Patent: November 19, 2013Assignee: Ajinomoto Co., Inc.Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
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Patent number: 8382996Abstract: Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.Type: GrantFiled: March 12, 2010Date of Patent: February 26, 2013Assignee: Ajinomoto Co., Inc.Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
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Patent number: 8357443Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.Type: GrantFiled: September 1, 2009Date of Patent: January 22, 2013Assignee: Ajinomoto Co., Inc.Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
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Publication number: 20110036625Abstract: Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.Type: ApplicationFiled: August 27, 2010Publication date: February 17, 2011Applicant: AJINOMOTO CO., INC.Inventors: HIROHISA NARAHASHI, SHIGEO NAKAMURA, TADAHIKO YOKOTA
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Publication number: 20100230382Abstract: Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.Type: ApplicationFiled: March 12, 2010Publication date: September 16, 2010Applicant: AJINOMOTO CO. INC.Inventors: Hirohisa NARAHASHI, Shigeo Nakamura, Tadahiko Yokota
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Publication number: 20100044078Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.Type: ApplicationFiled: September 1, 2009Publication date: February 25, 2010Applicant: AJINOMOTO CO., INC.Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
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Publication number: 20100040874Abstract: Films for metal film transfer, which contain (a) a support layer, (b) a release layer formed on the support layer, which is comprised of one or more kinds of water-soluble polymers selected from a water-soluble cellulose resin, a water-soluble polyester resin, and a water-soluble acrylic resin, and (c) a metal film layer formed on the release layer, show superior transferability of the metal film layer. Such films are useful for efficiently producing circuit boards by laminating the film for metal film transfer on a curable resin composition layer on a substrate such that the metal film layer is in contact with a surface of the curable resin composition layer, curing the curable resin composition layer, detaching the support layer, and removing the release layer on the metal film layer by dissolving the release layer in an aqueous solution.Type: ApplicationFiled: September 1, 2009Publication date: February 18, 2010Applicant: AJINOMOTO CO., INC.Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota